Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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ISPGAL22V10AC-5LN by Lattice Semiconductor is a 32-terminal EE PLD with 132 product terms and 11 dedicated inputs. Featuring a propagation delay of 5 ns, it operates at a max clock frequency of 143 MHz. Ideal for applications requiring fast processing speeds and programmable logic functions in compact designs.
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Low propagation delay ensures fast operation and quick response time, making it suitable for high-speed applications.
Surface mount technology offers space-saving and efficient PCB assembly, making it suitable for compact and modern electronic designs.
Operates at a low maximum supply voltage, making it energy-efficient and suitable for low-power applications.
CMOS technology provides low power consumption, high noise immunity, and allows for a wide operating voltage range.
Provides a sufficient number of inputs for versatile input configurations and logic operations.
Square package shape facilitates easy integration and alignment on the PCB, optimizing space efficiency and layout design.
Lead-free terminals comply with environmental regulations and offer improved reliability in soldering connections.
PAL-type architecture enables programmable logic with easy implementation of custom logic functions, offering flexibility in system design.
Stable nominal supply voltage ensures consistent performance and compatibility with standard power supply configurations.
Supports multiple power supplies for enhanced flexibility in power management and efficient utilization of power resources.
Adequate number of terminals for connections and interfacing with other components, facilitating system integration.
EE PLD technology allows for efficient and customizable programming of logic functions, catering to specific application requirements.
Various package styles offer flexibility in mounting options and thermal management, enhancing reliability and performance in different environments.
Macrocell output function provides versatile logic capabilities and ease of integration, enabling complex logic operations and signal processing.
Abundance of product terms allows for complex logic configurations and multiple logic operations, offering comprehensive logic processing capabilities.
Supports a low minimum supply voltage, enabling operation in low-power scenarios and enhancing energy efficiency.
Narrow terminal pitch enables high-density mounting and compact PCB layouts, optimizing space utilization and improving overall system design.
Well-organized input and output configuration simplifies system connectivity and improves signal routing for efficient logic operations.
Dedicated inputs cater to specific logic functions and signal processing tasks, offering customized input options for tailored system requirements.
Tin-lead terminal finishing provides reliable solder connections and compatibility with traditional soldering processes, ensuring robust electrical connections.
Quad terminal positioning enhances stability and ease of soldering, facilitating secure connections and reliable electrical contact.
Low maximum seated height allows for slim and compact PCB designs, reducing overall system profile and enhancing space efficiency.
Compact width dimensions enable space-saving integration in tight PCB layouts and small electronic devices, maximizing design flexibility.
High maximum clock frequency supports fast data processing and reliable timing control, making it suitable for real-time applications and high-speed operations.
Adequate number of outputs for comprehensive logic signal routing and versatile output configurations, enabling diverse system functionality.
High peak reflow temperature tolerance ensures robust solder connections and reliable performance during soldering processes, improving overall product durability.
Compact length dimensions facilitate space-efficient PCB layout and system integration, enhancing overall design aesthetics and functionality.
Sufficient I/O lines for versatile signal processing and input/output operations, offering flexibility in system interfacing and communication.
Programmable Logic Devices (PLD) ISPGAL22V10AC-5LN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Lattice Semiconductor
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ISPGAL22V10AC-5LN Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
Ksl Microdevices
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
Allegro MicroSystems
M39029/58360
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
Kec
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
BAV99
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ATF1502ASL-25AU44
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
XC9572XL-10TQG100C
Xilinx
XC9572XL-10TQG100C by Xilinx is a programmable logic device with 72 macro cells and CMOS technology. It has a max clock frequency of 100 MHz and can be used for in-system programming, making it suitable for various applications requiring high-speed processing and flexibility.
ATF1508ASL-25AU100
Microchip Technology
Microchip ATF1508ASL-25AU100 is a 128 macrocell EE PLD with 25ns propagation delay, in-system programmable, and supports JTAG boundary scan test. Ideal for industrial applications requiring high-speed processing up to 33.3MHz, with a wide operating temperature range from -40°C to 85°C. Package style is flatpack, thin profile, fine pitch for compact designs.
EPM7128SQC100-7N
Altera
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
XC2C128-6CPG132C
XC2C128-6CPG132C by Xilinx is a programmable logic device with 128 macro cells and 100 inputs/outputs. It has a max clock frequency of 152 MHz and can be used for applications requiring in-system programmability and high-speed data processing.
5M570ZM100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: TFBGA; Package Shape: SQUARE;
EPM7128SQI100-10
Intel
EPM7128SQI100-10 by Intel is a 128 macrocell EE PLD with 84 I/O lines, operating at up to 125 MHz. It features a propagation delay of 10 ns and can handle a max supply voltage of 5.5 V. Ideal for industrial applications requiring high-speed programmable logic devices in compact form factors.
5M2210ZF256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
5M1270ZF324C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE;
XC2C256-7VQ100I
XC2C256-7VQ100I by Xilinx is a 256 macrocell PLA-type FLASH PLD with 80 I/O lines, operating at max 108 MHz clock frequency. It features 7.5 ns propagation delay and can be in-system programmed. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities.
XCR3128XL-10VQG100C
Xilinx XCR3128XL-10VQG100C is a 128 macrocell EE PLD with 84 I/O lines, operating at max 95 MHz clock frequency. It has a propagation delay of 10 ns and supports JTAG boundary scan test. Ideal for applications requiring fast processing speeds and high I/O capabilities in commercial temperature environments.
EPM3128ATC100-7N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
XC2C384-10TQG144I
Xilinx XC2C384-10TQG144I is a 384 macrocell FLASH PLD with 118 I/O lines, 10 ns propagation delay, and 83 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing in a compact square package.
EPM7064SLC44-5N
EPM7064SLC44-5N by Intel is a 64 macrocell EE PLD with 5 ns propagation delay and 250 MHz max clock frequency. It is used in applications requiring programmable logic devices with in-system programmability, such as digital signal processing and control systems.
EPM7128SLC84-10N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
EPM3064ATC100-10N
The Altera EPM3064ATC100-10N is a programmable logic device with a maximum clock frequency of 100 MHz and 66 I/O lines. It has a propagation delay of 10 ns and operates on a nominal supply voltage of 3.3 V. This PLD is commonly used for applications requiring in-system programmability and macrocell output functions.
XC2C32A-6VQG44C
Xilinx XC2C32A-6VQG44C is a 32 macrocell FLASH PLD with 6ns propagation delay, operating at max 300MHz clock frequency. It's a CMOS technology-based programmable logic device in a plastic/epoxy package, suitable for applications requiring fast processing speeds and in-system programmability.
5M40ZM64I5N
Intel's 5M40ZM64I5N is a FLASH PLD with 30 I/O lines, 118.3 MHz clock frequency, and 14 ns propagation delay. Ideal for industrial applications requiring programmable logic devices in a compact square package with fine pitch grid array style.
5M2210ZF256C4N
XCR3512XL-10PQG208C
Xilinx XCR3512XL-10PQG208C is a 512 macrocell EE PLD with 180 I/O lines, operating at max 97 MHz clock frequency. It features 10 ns propagation delay and supports in-system programmability. Ideal for applications requiring high-speed logic processing and flexible reprogramming capabilities.
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ISPGAL22LV10-10LJ
Lattice Semiconductor
EE PLD; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
ISPGAL22V10AB-75LSI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;
ISPGAL22V10AB-75LS
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 1;
ISPGAL22V10AC-5LSI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC32,.2SQ,20;
ISPGAL22V10AC-75LSI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 1.95 V;
ISPGAL22V10AV-23LSN
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Propagation Delay: 2.3 ns;
ISPGAL22V10AV-5LSNI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Width: 5 mm;
ISPGAL22V10AV-5LSN
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Qualification: Not Qualified;
ISPGAL22V10AV-75LSI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N32;
ISPGAL22V10AB-5LNI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;
ISPGAL22V10AC-75LNI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
ISPGAL22V10AV-5LNI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Power Supplies (V): 3.3;
ISPGAL22V10AV-5LN
ISPGAL22V10AV-75LN
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Technology Used: CMOS;
ISPGAL22V10AV-5LNN
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Clock Frequency: 143 MHz;
ISPGAL22V10AB-5LNNI
ISPGAL22V10AC-5LNN
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: 1 mm;
ISPGAL22V10AC-75LNNI
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; No. of I/O Lines: 10;
ISPGAL22V10AB-5LNN
EE PLD; Form Of Terminal: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
ISPGAL22V10AC-23LNN
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