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ICE40UP3K-UWG30ITR50

Lattice Semiconductor

ICE40UP3K-UWG30ITR50 by Lattice Semiconductor

ICE40UP3K-UWG30ITR50 by Lattice Semiconductor is a 2800 logic cell FPGA with 350 CLBs, CMOS technology, and 21 inputs/outputs. It operates at 1.14-1.26V, has a max combinatorial delay of 9ns, and supports a peak reflow temp of 260°C. Ideal for applications requiring high-speed processing in compact designs.

Median Price

$4.780

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 30 parts In-Stock

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$4.780

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$4.208

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Nova Conductors

Japan . 43 parts In-Stock

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$3.525

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Vyrian

USA . 8,678 parts In-Stock

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Chip Stock

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Argo Parts USA

USA . 4,403 parts In-Stock

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$3.525

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Continental Prestige Electronics

USA . 4,251 parts In-Stock

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$3.525

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$3.455

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Netroflash

USA . 50 parts In-Stock

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$3.525

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$3.700

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Vigor

Singapore . 150 parts In-Stock

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$4.390

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AZTECH Wire

Italy . 637 parts In-Stock

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$11.765

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Microchip USA

USA . 2,488 parts In-Stock

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Corohmni

South Africa . 132 parts In-Stock

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Advanced Electronics

New Zealand . 323 parts In-Stock

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$143.798

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Aztec Data Supply Inc.

USA . 4,867 parts In-Stock

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$160.080

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Overview

Unlock the power of innovation with the ICE40UP3K-UWG30ITR50 by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array that offers limitless possibilities for your projects. Manufactured by industry leader Lattice Semiconductor, this FPGA boasts 2800 logic cells and 350 CLBs, making it an ideal choice for a wide range of applications. With a maximum supply voltage of 1.26V and advanced CMOS technology, this versatile device delivers unrivaled performance and reliability. Whether you're designing IoT devices, robotics, or consumer electronics, this FPGA provides the flexibility and efficiency you need to bring your ideas to life. Elevate your projects with the ICE40UP3K-UWG30ITR50 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging solution for the FPGA.

No. of Logic Cells: 2800

Offers a large number of logic cells for complex programmable logic designs.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs.

Maximum Supply Voltage: 1.26 V

Ensures safe operation within specified voltage limits.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

No. of Inputs: 21

Provides multiple input options for versatile design implementations.

Package Shape: RECTANGULAR

Facilitates easy integration into existing PCB layouts.

Nominal Supply Voltage (V): 1.2

Provides a stable supply voltage for consistent performance.

Packing Method: TR

Ensures secure packaging and handling during shipping and storage.

No. of Terminals: 30

Offers a sufficient number of terminals for connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for flexible programming and customizable logic functions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Features a compact package design for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Supports a wide input voltage range for versatile power supply options.

Maximum Operating Temperature: 100 °C

Operates reliably at elevated temperatures for industrial applications.

Pitch Of Terminal: 0.4 mm

Provides a fine pitch for high-density interconnectivity.

Maximum Combinatorial Delay of a CLB: 9 ns

Ensures fast signal processing and minimal delay within the logic blocks.

Organization: 350 CLBS

Offers a structured organization of logic blocks for efficient design implementation.

Minimum Operating Temperature: -40 °C

Operates reliably in harsh environments with low temperature conditions.

Position Of Terminal: BOTTOM

Facilitates easy soldering and mounting on the PCB.

Maximum Seated Height: 0.6 mm

Maintains a low profile for compact electronic devices.

Width: 2.114 mm

Compact width for space-efficient PCB layout designs.

No. of Outputs: 21

Provides multiple output options for diverse design requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder joint formation during the reflow soldering process.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes for industry-standard assembly.

Length: 2.537 mm

Compact length for space-efficient PCB layout designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) ICE40UP3K-UWG30ITR50 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2800

No. of Inputs:

21

No. of Outputs:

21

No. of CLBs:

350

CLB Maximum Delay:

9 ns

Technology:

CMOS

Organization:

350 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

1

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Very Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

2.537 mm

Width:

2.114 mm

Maximum Seated Height:

.6 mm

Packing Method:

Tape and Reel

Package Equivalence Code:

BGA30,5X6,16

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.4 mm

No. of Terminals:

30

Standards

JESD-30 Code:

R-PBGA-B30

Trade Compliance

ICE40UP3K-UWG30ITR50 Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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