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PXB4220E

Lantiq

PXB4220E by Lantiq

ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Vyrian

USA . 603 parts In-Stock

1+ parts

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603

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Digiode

USA . 318 parts In-Stock

1+ parts

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318

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A2Z Electronics, Inc.

USA . 2 parts In-Stock

1+ parts

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 167 parts In-Stock

1+ parts

$10.714

100+ parts

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167

$10.714

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Modulus Dynamics

Lithuania . 4,221 parts In-Stock

1+ parts

$11.251

100+ parts

$10.801

1k+ parts

$10.351

10k+ parts

-

4,221

$11.251

$10.801

$10.351

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Texas Native Microelectronics

USA . 4,021 parts In-Stock

1+ parts

$12.315

100+ parts

$11.822

1k+ parts

$11.453

10k+ parts

$10.837

4,021

$12.315

$11.822

$11.453

$10.837

Kenton Components

USA . 500 parts In-Stock

1+ parts

$14.778

100+ parts

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$13.005

500

$14.778

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$13.005

Qasali Group International

UK . 500 parts In-Stock

1+ parts

$33.250

100+ parts

-

1k+ parts

$30.923

10k+ parts

$29.260

500

$33.250

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$30.923

$29.260

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 945 parts In-Stock

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945

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Technical Specifications

ATM/SONET/SDH Circuits PXB4220E attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Lantiq

Specs

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.13 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

PXB4220E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Lantiq

Nevada January 6, 2015. REUTERS/Rick Wilking FRANKFURT (Reuters) - Intel has agreed to buy German network chipmaker Lantiq for an undisclosed amount to expand its range of chips used in Internet-connected gadgets, the companies said on Monday. The former Infineon unit was bought in 2009 by private equity firm Golden Gate Capital for 250 million euros ($280 million). Deutsche Telekom was among the companies invested in Lantiq through Golden Gate. Adding Internet connections to devices ranging from soccer balls to household and industrial machines, a trend dubbed the Internet of Things or M2M, has become a new battleground for Intel, Qualcomm and other technology companies. The number of wireless gadgets will more than double by the end of the decade, with most of the growth coming from smart devices other than PCs and smartphones, according to market research firm ABI Research. Lantiq also produces chips for copper, fiber and hybrid copper-fiber connections as well as mobile broadband and Wi-Fi which it sells to broadband access and telecom carrier equipment providers.Technology firms are betting heavily on Internet device-connected homes for future revenues and profit. Last year Samsung Electronics paid $200 million for U.S.-based start-up SmartThings, which makes software that helps control everything from door locks to light switches in homes.

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