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PEF4365T

Lantiq

PEF4365T by Lantiq

SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: HSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,015 parts In-Stock

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1,015

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Digiode

USA . 372 parts In-Stock

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372

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Prism Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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MARBEL Systems

Belgium . 5,152 parts In-Stock

1+ parts

$11.764

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$11.764

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Modulus Dynamics

Lithuania . 1,188 parts In-Stock

1+ parts

$12.726

100+ parts

$12.217

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$11.708

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1,188

$12.726

$12.217

$11.708

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Texas Native Microelectronics

USA . 2,189 parts In-Stock

1+ parts

$13.522

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$12.981

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$12.575

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$11.899

2,189

$13.522

$12.981

$12.575

$11.899

Kenton Components

USA . 100 parts In-Stock

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$16.226

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$14.279

100

$16.226

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$14.279

Qasali Group International

UK . 715 parts In-Stock

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$36.509

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$33.954

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$32.128

715

$36.509

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$32.128

Andel Nordic

Denmark . 379 parts In-Stock

1+ parts

$44.880

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$31.419

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$31.419

379

$44.880

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$31.419

A-Z Elektronik GmbH

Germany . 6,743 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 622 parts In-Stock

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Kepictronics

USA . 81 parts In-Stock

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Perfect Parts

USA . 9 parts In-Stock

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Technical Specifications

Analog Data Transmission Interfaces PEF4365T attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Lantiq

Specs

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

PEF4365T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Lantiq

Nevada January 6, 2015. REUTERS/Rick Wilking FRANKFURT (Reuters) - Intel has agreed to buy German network chipmaker Lantiq for an undisclosed amount to expand its range of chips used in Internet-connected gadgets, the companies said on Monday. The former Infineon unit was bought in 2009 by private equity firm Golden Gate Capital for 250 million euros ($280 million). Deutsche Telekom was among the companies invested in Lantiq through Golden Gate. Adding Internet connections to devices ranging from soccer balls to household and industrial machines, a trend dubbed the Internet of Things or M2M, has become a new battleground for Intel, Qualcomm and other technology companies. The number of wireless gadgets will more than double by the end of the decade, with most of the growth coming from smart devices other than PCs and smartphones, according to market research firm ABI Research. Lantiq also produces chips for copper, fiber and hybrid copper-fiber connections as well as mobile broadband and Wi-Fi which it sells to broadband access and telecom carrier equipment providers.Technology firms are betting heavily on Internet device-connected homes for future revenues and profit. Last year Samsung Electronics paid $200 million for U.S.-based start-up SmartThings, which makes software that helps control everything from door locks to light switches in homes.

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