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5962F0721804VXC

Intersil

5962F0721804VXC by Intersil

RF Power Bipolar Transistors; Peak Reflow Temperature (C): 260; Terminal Finish: Gold (Au); Qualification: Not Qualified; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 527 parts In-Stock

1+ parts

$273.875

100+ parts

$268.398

1k+ parts

$265.659

10k+ parts

$262.920

527

$273.875

$268.398

$265.659

$262.920

Northwest PG Solutions

USA . 832 parts In-Stock

1+ parts

$301.262

100+ parts

-

1k+ parts

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10k+ parts

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832

$301.262

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Supply Digital

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,034

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Technical Specifications

RF Power Bipolar Junction Transistors (BJT) 5962F0721804VXC attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from Intersil

Specs

JESD-609 Code:

e4

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Terminal Finish:

Gold (Au)

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

5962F0721804VXC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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