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EPCQ64SI16N

Intel

EPCQ64SI16N by Intel

EPCQ64SI16N by Intel is a 64MX1 NOR flash memory with 67108864-bit memory density. Operating at 3.3V, it offers a max clock frequency of 133 MHz and endurance of 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation in a small outline package style.

Median Price

$26.690

Lifecycle Status

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11

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Arrow

USA . 40 parts In-Stock

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$28.470

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$18.120

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Verical

USA . 40 parts In-Stock

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$24.910

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Digiode

USA . 1,069 parts In-Stock

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Bristol Electronics

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Vyrian

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Chip Stock

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Nova Conductors

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Flip Electronics

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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BCID Electronics Ltd.

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MARBEL Systems

Belgium . 2,025 parts In-Stock

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$2.317

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Kenton Components

USA . 450 parts In-Stock

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$3.196

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$2.812

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Corohmni

South Africa . 95 parts In-Stock

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$3.647

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Modulus Dynamics

Lithuania . 2,362 parts In-Stock

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$4.227

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$4.227

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$4.227

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Texas Native Microelectronics

USA . 7,280 parts In-Stock

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$5.223

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$5.014

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$4.857

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$4.596

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$4.596

Qasali Group International

UK . 2,648 parts In-Stock

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$7.190

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$6.687

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$6.327

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AZTECH Wire

Italy . 352 parts In-Stock

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$16.065

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One Stop Electronics

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Ampacity Inc.

Singapore . 40 parts In-Stock

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Semicontronic

India . 40 parts In-Stock

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$20.641

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$20.535

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Corphita

USA . 723 parts In-Stock

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Microchip USA

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Lixinc

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Continental Prestige Electronics

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Alle Elektronik GmbH

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Argo Parts USA

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Aranea Global

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S.R.D Solutions

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Supply Digital

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Perfect Parts

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Authorized Procurement Solutions

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Vigor

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Kepictronics

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Overview

Upgrade your storage capabilities with the Intel EPCQ64SI16N Flash Memory. Manufactured by Intel, this high-quality product offers exceptional reliability and performance in a compact design. Ideal for a wide range of applications, this flash memory provides fast and efficient data storage solutions. With a durable construction and advanced technology, the EPCQ64SI16N delivers value, benefits, and advantages that will enhance your experience. Trust Intel to provide top-notch products that meet your storage needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this flash memory product lightweight and durable.

Surface Mount: YES

With surface mount capability, this flash memory can be easily integrated into various electronic devices and circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space in electronic designs.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode ensures precise and synchronized data transfer, enhancing overall system performance.

Nominal Supply Voltage: 3.3V

The 3.3V nominal supply voltage provides a reliable power source for the flash memory, ensuring stable operation.

No. of Terminals: 16

With 16 terminals, this flash memory offers versatile connectivity options in electronic systems.

Package Style: SMALL OUTLINE

The small outline package style enables compact device designs, making this flash memory suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The flash memory's high maximum operating temperature allows for reliable performance in various environmental conditions.

Organization: 64MX1

The 64MX1 organization offers a high memory capacity, suitable for storing large amounts of data in electronic devices.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in managing data output, enhancing system versatility.

Technical Specifications

Flash Memory EPCQ64SI16N attributes and parameters. Explore more Flash Memory devices from Intel

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

2.7

Maximum Seated Height:

2.65 mm

Maximum Standby Current:

.0001 Amp

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Type:

NOR TYPE

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

8 ms

Trade Compliance

EPCQ64SI16N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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