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EP4CE10F17I7

Intel

EP4CE10F17I7 by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

Median Price

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 6,900 parts In-Stock

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Vyrian

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Digiode

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Northwest PG Solutions

USA . 2,194 parts In-Stock

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$2.695

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Semicontronic

India . 1,607 parts In-Stock

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$31.000

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$30.225

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$30.070

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Ampacity Inc.

Singapore . 1,902 parts In-Stock

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$33.000

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One Stop Electronics

USA . 1,400 parts In-Stock

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MARBEL Systems

Belgium . 731 parts In-Stock

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$40.996

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$39.356

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Vigor

Singapore . 626 parts In-Stock

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$50.670

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Kenton Components

USA . 50 parts In-Stock

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Texas Native Microelectronics

USA . 1,314 parts In-Stock

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$115.863

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$111.228

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$107.753

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Modulus Dynamics

Lithuania . 1,345 parts In-Stock

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$116.731

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Microchip USA

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Supply Digital

USA . 1,876 parts In-Stock

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Corphita

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Native Components

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Corohmni

South Africa . 412 parts In-Stock

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Qasali Group International

UK . 75 parts In-Stock

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$275.290

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Glotronic Ltd.

UK . 72 parts In-Stock

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP4CE10F17I7 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

10320

No. of Inputs:

179

No. of Outputs:

179

No. of CLBs:

645

Maximum Clock Frequency:

472.5 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

645 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP4CE10F17I7 Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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