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EP2C5F256I8

Intel

EP2C5F256I8 by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

Median Price

$48.900

Lifecycle Status

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8

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DigiKey

USA . 99 parts In-Stock

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Mouser Electronics

USA . 34 parts In-Stock

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Digiode

USA . 1,140 parts In-Stock

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$46.455

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Vyrian

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Dynamic Solutions

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Cyclops Electronics Ltd

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Flex Direct, LLC

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Bristol Electronics

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Vigor

Singapore . 509 parts In-Stock

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Semicontronic

India . 167 parts In-Stock

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Component Stockers USA

USA . 116 parts In-Stock

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Corphita

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Corohmni

South Africa . 164 parts In-Stock

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MARBEL Systems

Belgium . 3,307 parts In-Stock

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Texas Native Microelectronics

USA . 7,836 parts In-Stock

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Modulus Dynamics

Lithuania . 1,223 parts In-Stock

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Kenton Components

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Supply Digital

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RC Electronics

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Qasali Group International

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Metaverse IC Inc.

Canada . 340 parts In-Stock

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Perfect Parts

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Northwest PG Solutions

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Speed Components Ltd (Excess)

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GreenTree Electronics

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2C5F256I8 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

4608

No. of Inputs:

158

No. of Outputs:

150

No. of CLBs:

288

Maximum Clock Frequency:

402.5 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

288 CLBS

Additional Features:

Also requires 3.3 V supply

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.5/3.3,3.3 V

Temperature and Environmental Ratings

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP2C5F256I8 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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