Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP1SGX10CF672C6N by Intel is a FPGA with 10570 logic cells, 1200 CLBs, and 362 inputs/outputs. It operates at voltages b/w 1.425V to 1.575V, suitable for applications requiring high-speed processing and programmable ICs in various industries like telecommunications and automotive electronics. With a compact square package style of 27mm x 27mm, it offers flexibility and efficiency in design implementations.
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The use of plastic/epoxy material makes the package lightweight and cost-effective.
Having a high number of logic cells allows for complex programmable functions to be implemented efficiently.
Surface mount capability provides ease of installation and can save space on a PCB.
The low maximum supply voltage helps in reducing power consumption and heat generation.
A higher number of Configurable Logic Blocks (CLBs) allows for greater flexibility in designing custom logic circuits.
CMOS technology offers low power consumption and high noise immunity, making the FPGA energy efficient and reliable.
The large number of inputs provides versatile connectivity options for interfacing with external devices.
The square package shape ensures uniformity in PCB layout and placement, making it easier for assembly.
Ball terminals enable reliable and secure connections with the PCB, ensuring high signal integrity.
The nominal supply voltage of 1.5V is commonly used in many electronic systems, making it compatible with a wide range of applications.
The multiple power supply options cater to various voltage requirements, offering flexibility in system design.
The high number of terminals allows for extensive connectivity options and ease of integration with other components.
Being a Field Programmable Gate Array (FPGA) provides reconfigurability, allowing for quick prototyping and design changes.
The grid array package style offers high density mounting and efficient thermal performance.
The low minimum supply voltage ensures reliable operation even at low power levels.
With a maximum operating temperature of 85°C, the FPGA can withstand high temperature environments.
The small pitch of terminals allows for compact layout design and efficient use of PCB space.
Organizing 1200 Configurable Logic Blocks (CLBs) effectively enhances the scalability and complexity of logic circuits that can be implemented.
The FPGA can operate at temperatures as low as 0°C, making it suitable for a wide range of environments.
The use of tin, silver, and copper finishing on terminals ensures good conductivity and resistance to corrosion.
Bottom positioning of terminals simplifies the integration process and offers better thermal dissipation.
Having a MSL of 3 indicates that the FPGA is resistant to moisture, enhancing its reliability and durability.
The low maximum seated height allows for compact PCB designs and facilitates space-saving solutions.
The width of 27mm offers a good balance between compactness and ease of handling during installation and maintenance.
With 362 outputs, the FPGA can drive multiple digital signals simultaneously, enhancing its versatility in digital circuit design.
The length of 27mm provides a compact form factor, making it suitable for space-constrained applications.
Field Programmable Gate Arrays (FPGA) EP1SGX10CF672C6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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EP1SGX10CF672C6N Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
Microsemi
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
1N4148WS
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
EP4CE6E22C8N
Intel
EP4CE6E22C8N by Intel is a FPGA with 6272 logic cells, 392 CLBs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
10M16SAU169C8G
Altera
The Altera 10M16SAU169C8G is a field programmable gate array (FPGA) with 169 terminals in a square BGA package. It can operate between 0 to 85 degrees Celsius and is suitable for various applications that require FPGA functionality.
LFXP2-17E-5FTN256I
Lattice Semiconductor
LFXP2-17E-5FTN256I by Lattice Semiconductor is a 17000 Logic Cells FPGA with 2125 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 201 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or communication systems.
10M40DAF256I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 1.2;
M2GL010T-FGG484I
Microchip Technology's M2GL010T-FGG484I FPGA offers 12084 logic cells, 233 inputs/outputs, and operates at a max supply voltage of 1.26V. Ideal for industrial applications requiring high-performance CMOS technology in a compact grid array package with bottom terminals.
10M25SAE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XC3S500E-4FGG320C
Xilinx
Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.
XC7S50-2FTGB196I
Xilinx XC7S50-2FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 1mm pitch terminals.
LFE5U-25F-8BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
LCMXO2-1200HC-6SG32I
LCMXO2-1200HC-6SG32I by Lattice Semiconductor is a 1280 Logic Cells FPGA with 160 CLBs, 21 Inputs/Outputs. Operating at -40 to 100°C, it has a max supply voltage of 3.6V and nominal voltage of 2.5V. Ideal for industrial applications requiring high-performance in compact form factor.
EP3C25F324C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: RECTANGULAR;
XC7S25-1FTGB196I
Xilinx XC7S25-1FTGB196I FPGA offers 23360 logic cells, 1825 CLBs, and 1098 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a wide operating temperature range from -40 to 100 °C.
LCMXO2-256ZE-1UMG64I
LCMXO2-256ZE-1UMG64I by Lattice Semiconductor is a 256 logic cell FPGA with 44 inputs/outputs, operating at 1.2V. It comes in a square grid array package suitable for applications requiring high-density programmable ICs and operates b/w -40 to 100°C.
10M08SCM153I7G
Intel's 10M08SCM153I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style and 0.5mm terminal pitch.
XC6SLX9-3TQG144I
The Xilinx XC6SLX9-3TQG144I is a FPGA with 9152 logic cells, 715 CLBs, and 102 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors with low power consumption.
5CGXFC7C6F23I7N
Intel's 5CGXFC7C6F23I7N FPGA boasts 149500 logic cells, 240 inputs/outputs, and a max supply voltage of 1.13V. Ideal for applications requiring high-speed data processing and complex algorithm implementation in fields like telecommunications and automotive industries.
EP3C40F484I7N
EP3C40F484I7N by Intel is a FPGA with 39600 logic cells, 331 inputs/outputs, and max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its CMOS technology and grid array package style.
10M04SCU169C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
LCMXO256C-5TN100C
LCMXO256C-5TN100C by Lattice Semiconductor is a 256 Logic Cells FPGA with 32 CLBs and 78 Inputs/Outputs. Operating at 1.8V, it has a max supply voltage of 3.465V and can withstand temperatures up to 85°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
EP4CE40F23C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
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EP1S25F672C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
EP1SGX10CF672C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
EP1S20F484I6
EP1S20F484I6 by Intel is a FPGA with 18460 logic cells, 586 inputs/outputs, and operates at a max supply voltage of 1.575V. It is ideal for applications requiring high-speed processing and programmable ICs in electronic systems.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
EP1S20F484I6N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
EP1SGX40GF1020C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1020; Package Code: BGA; Package Shape: SQUARE;
EP1SGX25CF672C7N
EP1S30F780C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
EP1S30F780C7N by Altera is a plastic/epoxy FPGA with 32,470 logic cells and 3,819 CLBs. It operates on a supply voltage of 1.425V to 1.575V and has 726 inputs and outputs. This versatile IC is suitable for various applications in the commercial extended temperature range.
EP1S25F780C6N
EP1S40F780I6
EP1S40F780I6 by Intel is a CMOS-based FPGA with 41250 logic cells. It operates at a max supply voltage of 1.575V and has 822 inputs and outputs. This versatile device is commonly used in applications requiring programmable gate arrays for various purposes.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 20;
EP1S40F780I6N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
EP1SGX10CF672C6ES
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