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AT80612002928AC

Intel

AT80612002928AC by Intel

MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1366; Package Code: LGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 475 parts In-Stock

1+ parts

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475

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Chip Stock

USA . 135 parts In-Stock

1+ parts

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135

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Digiode

USA . 103 parts In-Stock

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103

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 27 parts In-Stock

1+ parts

$25.345

100+ parts

$23.064

1k+ parts

$20.783

10k+ parts

-

27

$25.345

$23.064

$20.783

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MARBEL Systems

Belgium . 100 parts In-Stock

1+ parts

$33.396

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100

$33.396

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Texas Native Microelectronics

USA . 91 parts In-Stock

1+ parts

$38.386

100+ parts

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$33.780

91

$38.386

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$33.780

Kenton Components

USA . 100 parts In-Stock

1+ parts

$46.063

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$40.536

100

$46.063

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$40.536

Qasali Group International

UK . 5,413 parts In-Stock

1+ parts

$103.642

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$91.205

5,413

$103.642

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$91.205

Ampacity Inc.

Singapore . 1,375 parts In-Stock

1+ parts

$752.000

100+ parts

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1,375

$752.000

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Corphita

USA . 370 parts In-Stock

1+ parts

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370

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Technical Specifications

Microprocessors AT80612002928AC attributes and parameters. Explore more Microprocessors devices from Intel

Specs

Boundary Scan:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-N1366

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

1730 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

AT80612002928AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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