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XMC4800F144F2048AAXQMA1

Infineon Technologies

XMC4800F144F2048AAXQMA1 by Infineon Technologies

XMC4800F144F2048AAXQMA1 by Infineon: 32-bit microcontroller with 3.13-3.63V supply, 2097152 ROM words, and 360448 RAM bytes. Ideal for industrial applications requiring CAN, Ethernet, I2C, SPI, UART connectivity and featuring 117 I/O lines for versatile integration.

Median Price

$27.663

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 319 parts In-Stock

1+ parts

$27.663

100+ parts

$19.508

1k+ parts

$17.334

10k+ parts

-

319

$27.663

$19.508

$17.334

-

DigiKey

USA . 114 parts In-Stock

1+ parts

$27.720

100+ parts

$19.812

1k+ parts

$18.124

10k+ parts

-

114

$27.720

$19.812

$18.124

-

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$13.570

1k+ parts

$12.140

10k+ parts

$11.420

5

-

$13.570

$12.140

$11.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 52 parts In-Stock

1+ parts

$14.316

100+ parts

-

1k+ parts

-

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52

$14.316

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$19.802

100+ parts

-

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-

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10

$19.802

-

-

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Vyrian

USA . 6,054 parts In-Stock

1+ parts

-

100+ parts

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6,054

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 245 parts In-Stock

1+ parts

$12.386

100+ parts

-

1k+ parts

-

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245

$12.386

-

-

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Ampacity Inc.

Singapore . 106 parts In-Stock

1+ parts

$12.810

100+ parts

-

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-

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106

$12.810

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-

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Semicontronic

India . 79 parts In-Stock

1+ parts

$12.810

100+ parts

$12.490

1k+ parts

$12.426

10k+ parts

-

79

$12.810

$12.490

$12.426

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Corphita

USA . 569 parts In-Stock

1+ parts

$13.563

100+ parts

-

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569

$13.563

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$19.406

100+ parts

-

1k+ parts

$18.630

10k+ parts

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2,000

$19.406

-

$18.630

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Continental Prestige Electronics

USA . 5,812 parts In-Stock

1+ parts

$19.802

100+ parts

-

1k+ parts

-

10k+ parts

$19.406

5,812

$19.802

-

-

$19.406

Aztec Data Supply Inc.

USA . 534 parts In-Stock

1+ parts

$47.720

100+ parts

-

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534

$47.720

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Microchip USA

USA . 7,269 parts In-Stock

1+ parts

$50.577

100+ parts

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10k+ parts

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7,269

$50.577

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-

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Modulus Dynamics

Lithuania . 2,674 parts In-Stock

1+ parts

$75.935

100+ parts

$72.898

1k+ parts

$69.860

10k+ parts

-

2,674

$75.935

$72.898

$69.860

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Corohmni

South Africa . 1,102 parts In-Stock

1+ parts

$81.238

100+ parts

-

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1,102

$81.238

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

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Argo Parts USA

USA . 1,106 parts In-Stock

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1,106

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Overview

Unlock the power of cutting-edge technology with the XMC4800F144F2048AAXQMA1 by Infineon Technologies. As a leader in microcontroller innovation, Infineon delivers top-quality products that guarantee reliability and performance. The XMC4800F144F2048AAXQMA1 is versatile and suitable for a wide range of applications, making it an essential tool for engineers and developers. With its advanced features and capabilities, this microcontroller offers unparalleled value, benefits, and advantages to customers looking to stay ahead in the fast-paced world of technology. Experience excellence with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the product durable and lightweight, perfect for various applications.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for efficient power management and operation within a wide range of voltage inputs.

Package Shape: SQUARE

The square package shape helps in optimizing the layout on a PCB, making it easier to design and assemble complex systems.

Bit Size: 32

The 32-bit architecture provides enhanced computational power and performance, suitable for demanding tasks and applications.

DAC Channels: YES

Having DAC channels allows for precise analog signal generation, making this product ideal for applications requiring accurate voltage outputs.

No. of Terminals: 144

With a high number of terminals, this product offers versatile connectivity options for interfacing with other components or peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles provide flexibility in mounting and heat dissipation, offering customization options based on specific application requirements.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures reliable operation even in environments where power sources may fluctuate, improving overall stability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for use in harsh environmental conditions without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN

The terminal finish with tin provides good conductivity and corrosion resistance, ensuring reliable connections for long-term use.

ADC Channels: YES

The presence of ADC channels enables accurate analog-to-digital conversion, making this product suitable for applications that require precise sensor readings or data acquisition.

DMA Channels: YES

Featuring DMA channels offers high-speed data transfer capabilities, improving overall system efficiency and performance.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, reducing the risk of signal loss or interference in demanding operating conditions.

ROM Words: 2097152

The large ROM size ensures ample storage space for program data and firmware, allowing for the implementation of complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height makes this product suitable for compact designs with strict space constraints, enabling integration in slim and lightweight devices.

Technical Specifications

Microcontrollers XMC4800F144F2048AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

117

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

360448

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

32-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4800F144F2048AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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