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XMC4800E196F2048AAXQMA1

Infineon Technologies

XMC4800E196F2048AAXQMA1 by Infineon Technologies

XMC4800E196F2048AAXQMA1 by Infineon is a 32-bit microcontroller with 196 terminals, featuring 2 DAC and 8 ADC channels. It operates at a max clock frequency of 40 MHz, suitable for industrial applications requiring CAN, Ethernet, I2C, SPI connectivity. With a ROM of 2097152 words and RAM of 360448 bytes, it offers high-speed performance in a compact package.

Median Price

$24.348

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 136 parts In-Stock

1+ parts

$24.348

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136

$24.348

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Vyrian

USA . 6,436 parts In-Stock

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6,436

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 549 parts In-Stock

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$19.870

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549

$19.870

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Corphita

USA . 923 parts In-Stock

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$23.067

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923

$23.067

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Component Stockers USA

USA . 2,829 parts In-Stock

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$32.750

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$28.840

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$23.420

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2,829

$32.750

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$23.420

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Microchip USA

USA . 2,860 parts In-Stock

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$52.187

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2,860

$52.187

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Modulus Dynamics

Lithuania . 1,687 parts In-Stock

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$69.243

100+ parts

$66.473

1k+ parts

$63.704

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1,687

$69.243

$66.473

$63.704

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Corohmni

South Africa . 867 parts In-Stock

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$76.911

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QUARKTWIN TECHNOLOGY LTD

USA . 16,755 parts In-Stock

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Continental Prestige Electronics

USA . 6,045 parts In-Stock

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Argo Parts USA

USA . 6,026 parts In-Stock

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Eastek

USA . 2,268 parts In-Stock

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Perfect Parts

USA . 1,270 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of innovation with the XMC4800E196F2048AAXQMA1 by Infineon Technologies. As a leading manufacturer in the field of microcontrollers, Infineon delivers top-quality products that push the boundaries of technology. This versatile microcontroller is ideal for a wide range of applications, providing customers with unparalleled performance and reliability. With advanced features like DAC channels, ADC channels, and DMA channels, this product offers exceptional value and benefits to meet all your needs. Upgrade your projects with the XMC4800E196F2048AAXQMA1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation of the microcontroller onto a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage of 3.63 V provides flexibility in power supply options for the microcontroller, enabling compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape is compact and optimized for efficient use of space on a circuit board, contributing to a more streamlined design.

Bit Size: 32

The 32-bit architecture of the microcontroller allows for processing and handling of data in larger chunks, improving overall performance and efficiency.

DAC Channels: YES

The presence of Digital-to-Analog Converter (DAC) channels enables the microcontroller to convert digital signals into analog outputs, expanding its versatility in various signal processing applications.

No. of Terminals: 196

With 196 terminals, the microcontroller offers ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing its functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures a secure and stable connection on the circuit board, facilitating reliable operation and ease of integration.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage requirement of 3.13 V allows for efficient power consumption, potentially extending battery life in portable devices or energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in a wide range of environmental conditions, making the microcontroller suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the microcontroller to function in harsh cold environments without compromising performance, expanding its usability across different temperature ranges.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-lasting performance of the microcontroller in various operating conditions.

ADC Channels: YES

The availability of Analog-to-Digital Converter (ADC) channels allows the microcontroller to convert analog signals into digital data, enabling precise measurement and control in diverse applications.

DMA Channels: YES

The presence of Direct Memory Access (DMA) channels in the microcontroller facilitates fast and efficient data transfers between memory and peripherals, reducing processor overhead and improving system performance.

Terminal Position: BOTTOM

The bottom terminal position of the microcontroller simplifies the PCB layout and routing, optimizing signal integrity and reducing electromagnetic interference in the system design.

ROM Words: 2097152

With 2,097,152 ROM words, the microcontroller offers ample storage capacity for storing program data and instructions, enabling complex software applications to run smoothly.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7 mm allows for a compact and slim profile of the microcontroller, saving space in device designs and enabling sleek and portable product form factors.

Digital To Analog Convertors: 2-Ch 12-Bit

The presence of two 12-bit Digital-to-Analog Converters (DACs) in the microcontroller allows for precise analog output generation, supporting high-resolution signal processing and control applications.

Width: 12 mm

The 12 mm width of the microcontroller contributes to its compact form factor, making it suitable for applications where space constraints are a concern.

Peripherals: CRC, DMA(2), ERU(2), LED, POR, POSIF(2), RTC, SCU, TEMPERATURE SENSOR, TIMER(5), WDT

The diverse set of peripherals, including CRC, DMA, ERU, LED, RTC, and temperature sensor, among others, enhances the functionality and versatility of the microcontroller, supporting a wide range of application requirements.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz enables fast and efficient operation of the microcontroller, facilitating real-time processing and response in time-critical applications.

Length: 12 mm

The 12 mm length of the microcontroller complements its compact width, resulting in a space-saving package suitable for integration into small and portable devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of the microcontroller ensures reliable performance in rugged industrial environments, making it a robust choice for industrial automation, control, and monitoring applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with Reduced Instruction Set Computing (RISC) architecture provides efficient and optimized processing capabilities, delivering high performance and low power consumption in embedded systems.

RAM Bytes: 360448

With 360,448 bytes of RAM, the microcontroller offers ample memory for data storage and processing, supporting multitasking and complex computing tasks in embedded applications.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages, making it suitable for battery-powered and portable devices.

Terminal Form: BALL

The ball terminal form of the microcontroller simplifies the soldering process during assembly, ensuring secure and reliable connections for robust system operation.

Analog To Digital Convertors: 8-Ch 12-Bit (4)

The presence of four 8-channel 12-bit Analog-to-Digital Converters (ADCs) in the microcontroller allows for simultaneous conversion of multiple analog signals with high precision, enabling accurate sensor interfacing and data acquisition.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable and efficient power delivery to the microcontroller, ensuring consistent performance and compatibility with standard voltage levels in electronic systems.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, SDMMC, SPI, UART, USB, USIC(6)

The connectivity options including CAN, Ethernet, I2C, LIN, SPI, USB, and more, enhance the communication capabilities of the microcontroller, enabling seamless integration with a variety of peripheral devices and networks.

ROM Programmability: FLASH

The programmable Flash ROM of the microcontroller allows for easy and flexible firmware updates, customization, and secure storage of program code, enhancing the versatility and longevity of the device.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the microcontroller offers a fine and precise spacing for soldering connections, ensuring reliable electrical contact and mechanical stability in the system.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity of the microcontroller, requiring standard handling and storage practices to maintain optimal performance and reliability.

Speed: 144 rpm

The microcontroller's speed rating of 144 revolutions per minute (rpm) denotes its processing speed capability, supporting rapid data handling and computation tasks in demanding applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM ensures efficient storage and retrieval of program instructions, contributing to the microcontroller's operational efficiency and performance.

No. of I/O Lines: 153

With 153 I/O lines, the microcontroller offers extensive input and output capabilities for interfacing with external components, sensors, and communication peripherals, enabling versatile system integration and control.

Technical Specifications

Microcontrollers XMC4800E196F2048AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

153

No. of Terminals:

196

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

360448

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, SDMMC, SPI, UART, USB, USIC(6)

Peripherals:

CRC, DMA(2), ERU(2), LED, POR, POSIF(2), RTC, SCU, TEMPERATURE SENSOR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit (4)

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4800E196F2048AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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