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XMC4700F100F1536AAXQMA1

Infineon Technologies

XMC4700F100F1536AAXQMA1 by Infineon Technologies

Infineon XMC4700F100F1536AAXQMA1 is a 32-bit microcontroller with 1572864 ROM words, 282624 RAM bytes, and 24-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers peripherals like CCU4(4), CCU8(2), DMA(2), and connectivity options such as CAN(6), ETHERNET, I2C, SPI(2). Operating at up to 40 MHz with a temperature range of -40 to 85 °C.

Median Price

$12.387

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 436 parts In-Stock

1+ parts

$17.030

100+ parts

$11.741

1k+ parts

$10.917

10k+ parts

-

436

$17.030

$11.741

$10.917

-

EBV Elektronik

Germany . 4,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,320

-

-

-

-

Rochester

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$9.910

1k+ parts

$8.870

10k+ parts

$8.340

540

-

$9.910

$8.870

$8.340

Verical

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$12.387

1k+ parts

$11.088

10k+ parts

$10.425

540

-

$12.387

$11.088

$10.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 424 parts In-Stock

1+ parts

$10.450

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$10.450

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$13.943

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$13.943

-

-

-

Vyrian

USA . 6,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,686

-

-

-

-

TME

Poland . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.350

10k+ parts

-

4,500

-

-

$13.350

-

NAC Semi

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$23.040

10k+ parts

$20.950

3,240

-

-

$23.040

$20.950

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,669 parts In-Stock

1+ parts

$9.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$9.350

-

-

-

Semicontronic

India . 1,521 parts In-Stock

1+ parts

$9.350

100+ parts

$9.116

1k+ parts

$9.070

10k+ parts

-

1,521

$9.350

$9.116

$9.070

-

Corphita

USA . 735 parts In-Stock

1+ parts

$9.900

100+ parts

-

1k+ parts

-

10k+ parts

-

735

$9.900

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$13.664

100+ parts

-

1k+ parts

$13.118

10k+ parts

-

2,000

$13.664

-

$13.118

-

Continental Prestige Electronics

USA . 4,153 parts In-Stock

1+ parts

$13.943

100+ parts

-

1k+ parts

-

10k+ parts

$13.664

4,153

$13.943

-

-

$13.664

Aztec Data Supply Inc.

USA . 46,407 parts In-Stock

1+ parts

$25.110

100+ parts

-

1k+ parts

-

10k+ parts

-

46,407

$25.110

-

-

-

Modulus Dynamics

Lithuania . 367 parts In-Stock

1+ parts

$41.237

100+ parts

$39.588

1k+ parts

$37.938

10k+ parts

-

367

$41.237

$39.588

$37.938

-

Corohmni

South Africa . 536 parts In-Stock

1+ parts

$45.744

100+ parts

-

1k+ parts

-

10k+ parts

-

536

$45.744

-

-

-

Microchip USA

USA . 2,546 parts In-Stock

1+ parts

$48.888

100+ parts

-

1k+ parts

-

10k+ parts

-

2,546

$48.888

-

-

-

Eastek

USA . 4,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,860

-

-

-

-

Argo Parts USA

USA . 2,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,411

-

-

-

-

Overview

Unlock the power of innovation with the XMC4700F100F1536AAXQMA1 from Infineon Technologies. Designed with precision and quality in mind, this microcontroller offers unparalleled performance and reliability for a wide range of applications. With advanced features like multiple DAC and ADC channels, as well as extensive connectivity options, this product provides customers with endless possibilities to bring their ideas to life. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations and transforms the way you approach your projects. Experience the difference with the XMC4700F100F1536AAXQMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for smaller form factor and higher component density, making the product ideal for compact designs.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for flexibility in power input, accommodating various power sources.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle during assembly, contributing to overall design efficiency.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex data processing tasks with precision and efficiency.

DAC Channels: YES

Digital-to-analog converters provide the ability to interface with analog components, expanding the product's compatibility.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and peripheral integration, enhancing the product's versatility.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures efficient power usage and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows for use in extreme temperature environments without compromising performance.

Terminal Finish: TIN

Tin finish on terminals provides good conductivity and corrosion resistance, ensuring excellent long-term reliability.

ADC Channels: YES

Analog-to-digital converters enable precise data acquisition from external analog sensors, enhancing the product's sensing capabilities.

DMA Channels: YES

Direct Memory Access channels improve data transfer speed and efficiency, making the product suitable for high-performance applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient processing capabilities and low power consumption, making it suitable for battery-operated devices.

RAM Bytes: 282624

The large RAM size allows for smooth multitasking and efficient data handling, making the product suitable for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the product's energy efficiency and reliability.

Analog To Digital Convertors: 24-Ch 12-Bit

Having 24 channels of high-resolution analog-to-digital converters ensures accurate and detailed analog signal processing capabilities.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage compatibility with common power sources makes the product easy to integrate into existing systems.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

The wide range of connectivity options allows for versatile interfacing with various devices and communication protocols, expanding the product's application possibilities.

ROM Programmability: FLASH

Flash programmable ROM enables easy firmware updates and customization, ensuring future-proof operation and flexibility.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product has moderate sensitivity to moisture, making it suitable for a variety of environmental conditions.

Technical Specifications

Microcontrollers XMC4700F100F1536AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

282624

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4700F100F1536AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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