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XMC4700E196K1536AAXQMA1

Infineon Technologies

XMC4700E196K1536AAXQMA1 by Infineon Technologies

Infineon XMC4700E196K1536AAXQMA1 is a 32-bit microcontroller with 196 terminals, featuring 282624 bytes of RAM and 1572864 ROM words. It operates at up to 40 MHz, supports CAN, Ethernet, I2C, SPI, UART among others. Ideal for automotive applications due to its -40 to 125 °C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,738 parts In-Stock

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Digiode

USA . 211 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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AZTECH Wire

Italy . 773 parts In-Stock

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$7.652

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Ampacity Inc.

Singapore . 1,525 parts In-Stock

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$10.000

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Corohmni

South Africa . 1,153 parts In-Stock

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$24.699

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Modulus Dynamics

Lithuania . 4,248 parts In-Stock

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$29.571

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$28.388

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$27.205

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Microchip USA

USA . 2,826 parts In-Stock

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$38.086

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Aztec Data Supply Inc.

USA . 2,073 parts In-Stock

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$54.757

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Component Stockers USA

USA . 534 parts In-Stock

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$173.320

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Continental Prestige Electronics

USA . 6,433 parts In-Stock

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Argo Parts USA

USA . 3,725 parts In-Stock

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Corphita

USA . 307 parts In-Stock

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Aranea Global

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Advanced Electronics

New Zealand . 28 parts In-Stock

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Overview

Unleash the power of innovation with the XMC4700E196K1536AAXQMA1 by Infineon Technologies, a cutting-edge microcontroller that redefines excellence in the automotive industry. With Infineon's reputation for top-quality manufacturing, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features like multiple ADC and DAC channels, extensive connectivity options, and a robust peripheral set. Experience seamless integration, enhanced functionality, and optimized efficiency with the XMC4700E196K1536AAXQMA1 - your key to unlocking endless possibilities in automotive electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan and reliability.

Maximum Supply Voltage: 3.63 V

Allows for flexibility in power supply options while operating the microcontroller.

Bit Size: 32

Offers a high level of processing power and capability for handling complex tasks and calculations.

DAC Channels: YES

Enables the generation of analog signals for various applications, expanding the functionality of the microcontroller.

ADC Channels: YES

Allows for the conversion of analog signals to digital data, providing accurate input data for the microcontroller.

RAM Bytes: 282624

Provides ample memory storage for data processing and temporary storage of variables, enhancing overall performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making the microcontroller efficient and reliable.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Offers a wide range of connectivity options, making it versatile and compatible with various interfaces and devices.

Technical Specifications

Microcontrollers XMC4700E196K1536AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

153

No. of Terminals:

196

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

282624

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

32-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4700E196K1536AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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