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XMC4700E196F2048AAXQMA1

Infineon Technologies

XMC4700E196F2048AAXQMA1 by Infineon Technologies

XMC4700E196F2048AAXQMA1 by Infineon is a 32-bit microcontroller with 196 terminals, 2 DAC channels, and 32 ADC channels. It operates at a max frequency of 40 MHz and has peripherals like CCU4, CCU8, DMA, and more. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.

Median Price

$13.940

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 306 parts In-Stock

1+ parts

$25.070

100+ parts

$18.764

1k+ parts

$16.256

10k+ parts

-

306

$25.070

$18.764

$16.256

-

Avnet

USA . 5,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.693

10k+ parts

$12.154

5,590

-

-

$12.693

$12.154

Rochester

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$12.150

1k+ parts

$10.870

10k+ parts

$10.230

152

-

$12.150

$10.870

$10.230

Verical

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$15.188

1k+ parts

$13.588

10k+ parts

$12.787

152

-

$15.188

$13.588

$12.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 952 parts In-Stock

1+ parts

$7.704

100+ parts

-

1k+ parts

-

10k+ parts

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952

$7.704

-

-

-

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$14.937

100+ parts

-

1k+ parts

-

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76

$14.937

-

-

-

Vyrian

USA . 5,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,893

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,902 parts In-Stock

1+ parts

$6.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,902

$6.890

-

-

-

Semicontronic

India . 1,895 parts In-Stock

1+ parts

$6.890

100+ parts

$6.718

1k+ parts

$6.683

10k+ parts

-

1,895

$6.890

$6.718

$6.683

-

Corphita

USA . 266 parts In-Stock

1+ parts

$7.298

100+ parts

-

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-

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266

$7.298

-

-

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Continental Prestige Electronics

USA . 4,109 parts In-Stock

1+ parts

$14.937

100+ parts

-

1k+ parts

-

10k+ parts

$14.638

4,109

$14.937

-

-

$14.638

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.937

100+ parts

$14.638

1k+ parts

-

10k+ parts

-

2,000

$14.937

$14.638

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-

Microchip USA

USA . 2,471 parts In-Stock

1+ parts

$49.312

100+ parts

-

1k+ parts

-

10k+ parts

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2,471

$49.312

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-

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Corohmni

South Africa . 98 parts In-Stock

1+ parts

$58.935

100+ parts

-

1k+ parts

-

10k+ parts

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98

$58.935

-

-

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Modulus Dynamics

Lithuania . 92 parts In-Stock

1+ parts

$72.486

100+ parts

$69.587

1k+ parts

$66.687

10k+ parts

-

92

$72.486

$69.587

$66.687

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Aztec Data Supply Inc.

USA . 29 parts In-Stock

1+ parts

$81.130

100+ parts

-

1k+ parts

-

10k+ parts

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29

$81.130

-

-

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Argo Parts USA

USA . 4,595 parts In-Stock

1+ parts

-

100+ parts

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4,595

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Advanced Electronics

New Zealand . 63 parts In-Stock

1+ parts

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63

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Overview

Experience the power of innovation with the XMC4700E196F2048AAXQMA1 by Infineon Technologies. As a leader in the microcontroller industry, Infineon Technologies delivers top-quality products that excel in performance and reliability. The XMC4700E196F2048AAXQMA1 offers unparalleled value with its advanced features and wide range of applications. From industrial automation to automotive systems, this microcontroller is designed to meet your needs with precision and efficiency. Elevate your projects with the XMC4700E196F2048AAXQMA1 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.63 V

Can handle higher voltage inputs for versatility in different applications.

Package Shape: SQUARE

Helps in efficient space utilization on the PCB.

Bit Size: 32

Allows for processing of larger data sizes and more complex algorithms.

DAC Channels: YES

Enables analog output capabilities for various interfacing requirements.

No. of Terminals: 196

Offers plenty of connectivity options for peripherals and external devices.

Minimum Supply Voltage: 3.13 V

Allows for operation even in low voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures for diverse applications.

Terminal Finish: TIN SILVER

Provides corrosion resistance and reliable electrical connections.

ADC Channels: YES

Enables analog input capabilities for data acquisition and sensor interfacing.

DMA Channels: YES

Facilitates direct memory access for efficient data transfer.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides faster execution of instructions for improved performance.

RAM Bytes: 360448

Offers ample memory for data storage and processing requirements.

Analog To Digital Convertors: 32-Ch 12-Bit

Allows for high-resolution analog to digital conversion for precise measurements.

Connectivity: CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Supports a wide range of communication protocols for versatile interfacing options.

Technical Specifications

Microcontrollers XMC4700E196F2048AAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

153

No. of Terminals:

196

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

360448

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

144 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET, I2C, I2S, LIN, MMC, SD, SPI(2), UART, USB, USIC(6)

Peripherals:

CCU4(4), CCU8(2), DMA(2), DTS, EBU, LED, POSIF(2) ,SCU, RTC, WDT

Analog To Digital Convertors:

32-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4700E196F2048AAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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