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XMC4100F64F128BAXQMA1

Infineon Technologies

XMC4100F64F128BAXQMA1 by Infineon Technologies

XMC4100F64F128BAXQMA1 by Infineon: 32-bit microcontroller with 131072 ROM words, 20480 RAM bytes, and 9-Ch 12-Bit ADC. Ideal for industrial applications requiring CAN, USB connectivity and operating at -40 to 85 °C.

Median Price

$4.579

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 162 parts In-Stock

1+ parts

-

100+ parts

$4.070

1k+ parts

$3.640

10k+ parts

$3.420

162

-

$4.070

$3.640

$3.420

Verical

USA . 162 parts In-Stock

1+ parts

-

100+ parts

$5.088

1k+ parts

$4.550

10k+ parts

$4.275

162

-

$5.088

$4.550

$4.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 553 parts In-Stock

1+ parts

$4.284

100+ parts

-

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-

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-

553

$4.284

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-

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Vyrian

USA . 8,501 parts In-Stock

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8,501

-

-

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Nova Conductors

Japan . 400 parts In-Stock

1+ parts

-

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400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 162 parts In-Stock

1+ parts

$3.830

100+ parts

-

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-

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162

$3.830

-

-

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Corphita

USA . 485 parts In-Stock

1+ parts

$4.059

100+ parts

-

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-

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485

$4.059

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-

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Component Stockers USA

USA . 212 parts In-Stock

1+ parts

$4.580

100+ parts

$4.300

1k+ parts

-

10k+ parts

-

212

$4.580

$4.300

-

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AZTECH Wire

Italy . 1,044 parts In-Stock

1+ parts

$13.180

100+ parts

-

1k+ parts

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1,044

$13.180

-

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Corohmni

South Africa . 273 parts In-Stock

1+ parts

$20.264

100+ parts

-

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273

$20.264

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Microchip USA

USA . 5,869 parts In-Stock

1+ parts

$29.926

100+ parts

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5,869

$29.926

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Modulus Dynamics

Lithuania . 1,467 parts In-Stock

1+ parts

$85.626

100+ parts

$82.201

1k+ parts

$78.776

10k+ parts

-

1,467

$85.626

$82.201

$78.776

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Perfect Parts

USA . 2,330 parts In-Stock

1+ parts

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2,330

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of your next project with the XMC4100F64F128BAXQMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers exceptional quality and reliability. This microcontroller offers a wide range of applications, making it versatile for various projects. With its advanced features and high-performance capabilities, this product provides immense value to customers seeking efficiency and innovation. Experience the benefits and advantages that the XMC4100F64F128BAXQMA1 brings to your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a wide range of applications.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Bit Size: 32

The 32-bit architecture provides high computational power and efficiency for complex tasks and applications.

ADC Channels: YES

The presence of Analog to Digital Convertor channels allows for interfacing with analog sensors and inputs, making the product versatile in data acquisition applications.

ROM Words: 131072

With a large ROM capacity of 131072 words, the product can store a significant amount of program data, enabling complex algorithm execution.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enhances processing speed and efficiency, making it ideal for real-time applications and control systems.

RAM Bytes: 20480

The substantial RAM capacity of 20480 bytes allows for efficient data processing and storage, enabling smooth operation of software applications.

Technical Specifications

Microcontrollers XMC4100F64F128BAXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), USB, USIC(4)

Peripherals:

DMA(8), DTS, LEDTS, POR, PWM, RTC, TIMER(), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XMC4100F64F128BAXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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