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XMC1201T038F0200ABXUMA1

Infineon Technologies

XMC1201T038F0200ABXUMA1 by Infineon Technologies

Infineon's XMC1201T038F0200ABXUMA1 is a 32-bit microcontroller with 204800 ROM words, 16384 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 32 MHz, it features peripherals like POR, RTC, TIMER(4), TSE, WDT, and USIC(2) connectivity.

Median Price

$3.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,968 parts In-Stock

1+ parts

$3.270

100+ parts

$2.010

1k+ parts

$1.490

10k+ parts

$1.390

2,968

$3.270

$2.010

$1.490

$1.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 256 parts In-Stock

1+ parts

$2.812

100+ parts

-

1k+ parts

-

10k+ parts

-

256

$2.812

-

-

-

Chip Stock

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,500

-

-

-

-

Vyrian

USA . 3,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,654

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 278 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$2.664

-

-

-

Modulus Dynamics

Lithuania . 872 parts In-Stock

1+ parts

$3.171

100+ parts

$3.044

1k+ parts

$2.917

10k+ parts

-

872

$3.171

$3.044

$2.917

-

Component Stockers USA

USA . 8,861 parts In-Stock

1+ parts

$4.700

100+ parts

$3.460

1k+ parts

$2.480

10k+ parts

-

8,861

$4.700

$3.460

$2.480

-

Microchip USA

USA . 5,768 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,768

-

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 5,169 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,169

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

-

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Kepictronics

USA . 45 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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45

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Overview

Unlock the power of cutting-edge technology with the XMC1201T038F0200ABXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their microcontrollers. This versatile device is perfect for a wide range of applications, offering unmatched performance and efficiency. With its advanced features and innovative design, the XMC1201T038F0200ABXUMA1 provides exceptional value and benefits to customers looking to take their projects to the next level. Upgrade your system today and experience the difference with Infineon's state-of-the-art microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, suitable for a wide range of applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows the microcontroller to work efficiently with various power sources, providing flexibility in design.

Bit Size: 32

The 32-bit architecture of the microcontroller offers high computational power and performance for demanding tasks.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its application range.

ROM Words: 204800

With a large ROM capacity of 204800 words, this microcontroller can store a significant amount of program data and instructions.

Technology: CMOS

The CMOS technology used in this microcontroller results in low power consumption and high noise immunity, making it efficient and reliable in various environments.

Analog To Digital Convertors: 12-Ch 12-Bit

Having 12 channels of 12-bit ADC allows for precise and accurate conversion of analog signals, ensuring reliable data acquisition in sensor applications.

RAM Bytes: 16384

The ample RAM capacity of 16384 bytes enables the microcontroller to handle complex computations and data processing tasks efficiently.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz ensures fast processing speed, suitable for real-time applications and high-speed data processing.

Connectivity: USIC(2)

The presence of 2 Universal Serial Interface Controllers enhances the connectivity options of the microcontroller, allowing for versatile communication protocols.

Technical Specifications

Microcontrollers XMC1201T038F0200ABXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

LEDTS(2) CONSIDERED FROM S DOC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Bytes:

16384

ROM Words:

204800

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

33.2 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USIC(2)

Peripherals:

POR, RTC, TIMER(4), TSE, WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

XMC1201T038F0200ABXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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