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TLE7368EXUMA2

Infineon Technologies

TLE7368EXUMA2 by Infineon Technologies

TLE7368EXUMA2 by Infineon Technologies is a Power Management IC with 1 function. It has a nominal voltage of 13.5V and can handle a max supply voltage of 45V. This IC is commonly used in power supply management circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,860 parts In-Stock

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6,860

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Digiode

USA . 738 parts In-Stock

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738

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 903 parts In-Stock

1+ parts

$5.500

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903

$5.500

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AZTECH Wire

Italy . 839 parts In-Stock

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$7.294

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839

$7.294

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Modulus Dynamics

Lithuania . 3,051 parts In-Stock

1+ parts

$15.730

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$15.101

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$14.472

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3,051

$15.730

$15.101

$14.472

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Microchip USA

USA . 4,524 parts In-Stock

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4,524

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Corphita

USA . 785 parts In-Stock

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785

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the TLE7368EXUMA2 by Infineon Technologies, a high-quality Power Management IC designed with your needs in mind. With its compact rectangular shape and small outline package style, this innovative product provides an outstanding solution for a wide range of applications. Trust in Infineon's expertise and experience as a leading manufacturer to deliver exceptional performance and reliability. The TLE7368EXUMA2 offers adjustable thresholds, surface mount capability, and a nominal supply voltage of 13.5V, ensuring maximum convenience and flexibility. Experience the value, benefits, and advantages this product brings to your projects, and unlock new possibilities in power supply management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during handling or operation.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on a PCB, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape helps optimize space utilization on the PCB, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 13.5 V

The optimal supply voltage ensures efficient and stable performance of the power management IC.

No. of Terminals: 36

Having a higher number of terminals allows for greater connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design help in saving valuable space on the PCB and enable compact product designs.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connection, minimizing the risk of failure.

Maximum Seated Height: 2.55 mm

The low seated height of the package helps in achieving a slim profile for the overall product design.

Width (mm): 7.6 mm

The compact width of the IC allows for efficient space utilization on the PCB and supports miniaturization of the product.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

The IC is specifically designed for power supply management, offering optimized performance and efficiency in regulating power.

Minimum Supply Voltage (Vsup): 4.5 V

Support for a wide range of supply voltages ensures compatibility with various power sources and applications.

Length: 12.8 mm

The moderate length of the IC provides a balance between compactness and functionality, making it suitable for different design requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the power management IC.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable operation of the IC in various conditions.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for close spacing of terminals, enabling high-density integration and efficient use of PCB real estate.

Maximum Supply Voltage (Vsup): 45 V

Support for a high supply voltage range makes the IC versatile and suitable for a wide range of applications requiring varying power levels.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and fine-tuning of the power management parameters to meet specific application requirements.

Technical Specifications

Power Management ICs TLE7368EXUMA2 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G36

Length:

12.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2.55 mm

Maximum Supply Voltage (Vsup):

45 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

7.6 mm

Trade Compliance

TLE7368EXUMA2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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