Loading...

TLE7368EXT

Infineon Technologies

TLE7368EXT by Infineon Technologies

TLE7368EXT by Infineon Technologies is a Power Management IC with 36 terminals and a supply voltage range of 4.5V to 45V. It features an adjustable threshold, CMOS technology, and a small outline package shape suitable for power supply management circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

919

-

-

-

-

Vyrian

USA . 854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

854

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,156 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$2.500

-

-

-

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$5.989

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$5.989

-

-

-

Modulus Dynamics

Lithuania . 762 parts In-Stock

1+ parts

$9.237

100+ parts

$8.868

1k+ parts

$8.498

10k+ parts

-

762

$9.237

$8.868

$8.498

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Corphita

USA . 361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

361

-

-

-

-

Overview

Experience unparalleled power management with the TLE7368EXT from Infineon Technologies. Crafted with precision and reliability in mind, this Power Management IC offers a wide range of applications, making it a versatile solution for various projects. With its high-quality construction and advanced technology, this product ensures optimal performance and efficiency. Trust in Infineon Technologies to deliver top-notch products that provide value, benefits, and advantages to customers, setting new standards in the industry. Elevate your power management capabilities with the TLE7368EXT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and cost-effective, making the product easy to handle and reducing manufacturing costs.

Surface Mount: Yes

Surface mount technology allows for easy and efficient PCB assembly, saving space and improving reliability.

Nominal Supply Voltage (Vsup): 13.5 V

The 13.5V supply voltage is ideal for a wide range of applications, providing a stable power source for various devices.

No. of Terminals: 36

With 36 terminals, the power management IC offers multiple connection points for different components, enhancing versatility.

Technology: CMOS

CMOS technology consumes low power and offers high noise immunity, leading to efficient power management and reliable operation.

Maximum Supply Voltage (Vsup): 45 V

Having a maximum supply voltage of 45V allows the IC to handle a wide range of input voltages, making it suitable for diverse applications.

Adjustable Threshold: Yes

The adjustable threshold feature enables customization of voltage levels, increasing flexibility in power management settings.

Technical Specifications

Power Management ICs TLE7368EXT attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G36

Length:

12.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2.55 mm

Maximum Supply Voltage (Vsup):

45 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

7.6 mm

Trade Compliance

TLE7368EXT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15