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TLE49642MXTMA1/SAMPLE

Infineon Technologies

TLE49642MXTMA1/SAMPLE by Infineon Technologies

TLE49642MXTMA1/SAMPLE by Infineon is a magnetic field sensor with 32V max supply voltage, 5.5mT hysteresis, and 0-25mA output range. It is a Hall effect sensor used for current output applications in various industries due to its compact size and wide operating temperature range of -40 to 170°C.

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 61 parts In-Stock

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$1.889

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$1.813

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$1.738

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Aztec Data Supply Inc.

USA . 1,915 parts In-Stock

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Corohmni

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Semicontronic

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Argo Parts USA

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Overview

Elevate your projects to new heights with the TLE49642MXTMA1/SAMPLE by Infineon Technologies. As a leader in magnetic field sensors, Infineon delivers unparalleled quality and reliability in every product. Designed for a wide range of applications, this sensor offers precise measurements and seamless integration, providing customers with exceptional value and performance. Whether you're working on automotive, industrial, or consumer electronics projects, trust the TLE49642MXTMA1/SAMPLE to deliver accurate results and elevate your designs to the next level.

Feature Benefit Bullets

Maximum Supply Voltage: 32 V

High maximum supply voltage allows for a wide range of operating conditions and compatibility with different setups.

Hysteresis: 5.5 mT

Low hysteresis ensures accuracy and reliability in detecting small changes in magnetic fields.

Body Width: 1.3 inch

Compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR,HALL EFFECT

Hall effect sensors provide high sensitivity and accuracy in measuring magnetic fields.

Body Height: 1 mm

Low body height allows for easy integration into various devices and systems.

Package Shape or Style: RECTANGULAR

Rectangular package design offers versatility in mounting and placement options.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 170 °C

High maximum operating temperature allows for use in extreme environmental conditions.

Output Range: 0-25mA

Wide output range provides flexibility in measuring different intensity levels of magnetic fields.

Output Type: CURRENT OUTPUT

Current output offers real-time measurement data for accurate monitoring and control purposes.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in cold environments.

Maximum Operating Current: 2.5 mA

Low operating current results in energy efficiency and minimal power consumption.

Housing: PLASTIC

Plastic housing provides durability and lightweight design for easy handling and installation.

Minimum Range Of Magnetic Field: 15.9 mT

Wide minimum magnetic field range allows for detection of weak magnetic fields.

Maximum Output Current: 25 A

High maximum output current capacity ensures compatibility with various output devices and systems.

Maximum Magnetic Field Range: 36 mT

Wide maximum magnetic field range allows for detection of strong magnetic fields.

Body Length/Diameter: 2.9 mm

Compact body length/diameter makes it suitable for applications where space is limited.

Termination Type: SOLDER

Solder termination offers secure and reliable connections for accurate data transmission.

Mounting Feature: SURFACE MOUNT

Surface mount capability ensures easy and secure installation on PCBs or other surfaces.

Technical Specifications

Magnetic Field Sensors TLE49642MXTMA1/SAMPLE attributes and parameters. Explore more Magnetic Field Sensors devices from Infineon Technologies

Specs

Additional Features:

REVERSE POLARITY PROTECTION

Body Width:

1.3 inch

Body Height:

1 mm

Body Length/Diameter:

2.9 mm

Housing:

PLASTIC

Hysteresis:

5.5 mT

Maximum Magnetic Field Range:

36 mT

Minimum Range Of Magnetic Field:

15.9 mT

Mounting Feature:

Maximum Operating Current:

2.5 mA

Maximum Operating Temperature:

170 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

25 A

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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