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TLE4945LXA

Infineon Technologies

TLE4945LXA by Infineon Technologies

TLE4945LXA by Infineon Technologies is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 10mT. It features digital current output, operates at a max current of 8mA, and comes in a rectangular plastic housing. Ideal for applications requiring precise magnetic field sensing in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,033 parts In-Stock

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Digiode

USA . 1,000 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Modulus Dynamics

Lithuania . 1,398 parts In-Stock

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$2.918

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$2.801

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$2.685

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1,398

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AZTECH Wire

Italy . 862 parts In-Stock

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$17.232

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Ampacity Inc.

Singapore . 209 parts In-Stock

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$30.750

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Semicontronic

India . 1,244 parts In-Stock

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$40.750

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$39.731

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$39.528

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Argo Parts USA

USA . 3,445 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Continental Prestige Electronics

USA . 370 parts In-Stock

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Corphita

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Overview

Experience the precision and reliability of the TLE4945LXA by Infineon Technologies, a leading manufacturer in magnetic field sensors. This sensor offers unparalleled accuracy and efficiency, making it ideal for a wide range of applications. From automotive to industrial, this sensor provides valuable insights and data to enhance performance and optimize processes. Discover the difference that quality craftsmanship and advanced technology can make with the TLE4945LXA.

Feature Benefit Bullets

Maximum Supply Voltage: 24 V

Allows for a wide range of power supply options, providing flexibility in system design.

Hysteresis: 10 mT

Provides accurate and stable sensing of magnetic fields with minimal error.

Body Width: 1.52 inch

Compact size allows for easy integration into various applications.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR,HALL EFFECT

Utilizes Hall Effect technology for precise and reliable magnetic field detection.

Package Shape or Style: RECTANGULAR

Sleek and modern design for seamless integration into electronic systems.

Minimum Supply Voltage: 3.8 V

Low minimum supply voltage for energy-efficient operation.

Output Type: DIGITAL CURRENT

Digital output simplifies data processing and integration with digital systems.

Maximum Operating Current: 8 mA

Low operating current for reduced power consumption and heat generation.

Housing: PLASTIC

Lightweight and durable housing material for long-lasting performance.

Body Length/Diameter: 4.16 mm

Small form factor for space-constrained applications.

Termination Type: SOLDER

Secure and reliable solder connection for stable operation.

Mounting Feature: THROUGH HOLE MOUNT

Easy installation and secure mounting option for stability in use.

Technical Specifications

Magnetic Field Sensors TLE4945LXA attributes and parameters. Explore more Magnetic Field Sensors devices from Infineon Technologies

Specs

Body Width:

1.52 inch

Body Length/Diameter:

4.16 mm

Housing:

PLASTIC

Hysteresis:

10 mT

Mounting Feature:

Maximum Operating Current:

8 mA

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

24 V

Minimum Supply Voltage:

3.8 V

Termination Type:

SOLDER

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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