Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Repetitive Peak Reverse Voltage: 1600 V; Non Repetitive Peak On-state Current: 500 A; Maximum DC Gate Trigger Current: 150 mA; Maximum Holding Current: 200 mA;
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Modulus Dynamics
$4.940
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Corphita
Silicon Controlled Rectifiers (SCR) TDB6HK74N16RROF attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies
Configuration:
Maximum DC Gate Trigger Current:
Maximum DC Gate Trigger Voltage:
Maximum Holding Current:
Maximum Leakage Current:
Non Repetitive Peak On-state Current:
No. of Elements:
Maximum Operating Temperature:
Minimum Operating Temperature:
Repetitive Peak Reverse Voltage:
Sub-Category:
Trigger Device Type:
TDB6HK74N16RROF Triggering Devices trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
1552200253
Molex
WIRE AND CABLE;
Yangzhou Yangjie Electronics
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
F1827SDK1000
Cynergy3 Components
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS; Case Connection: ISOLATED;
2N2323
Semicoa
SCR; Package Style (Meter): CYLINDRICAL; Surface Mount: NO; Terminal Position: BOTTOM; Configuration: SINGLE; Minimum Operating Temperature: -65 Cel;
P131
Vishay Semiconductors
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: BRIDGE; Case Connection: ISOLATED;
2N1916
International Rectifier
SCR; Package Style (Meter): POST/STUD MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: SINGLE; Minimum Operating Temperature: -40 Cel;
MCC95-08IO8B
IXYS Corporation
2N2323AS
Silicon Transistor
SCR; Package Style (Meter): CYLINDRICAL; Surface Mount: NO; Terminal Position: BOTTOM; Configuration: SINGLE; JESD-30 Code: O-MBCY-W3;
2N684
2N684 by Texas Instruments is a Silicon Controlled Rectifier with 30mA DC Gate Trigger Current, 150A Non Repetitive Peak On-state Current, and 16A Max On-state Current. It operates b/w -60°C to 125°C and has a max DC Gate Trigger Voltage of 3V. Ideal for applications requiring high current handling capabilities like power control systems.
Vpt Components
SCR; Package Style (Meter): CYLINDRICAL; Surface Mount: NO; Terminal Position: BOTTOM; Configuration: SINGLE; Maximum Operating Temperature: 125 Cel;
B612F-2T
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: BRIDGE, HALF-CONTROLLED, COMMON CATHODE WITH BUILT-IN DIODE; Case Connection: ISOLATED;
TIC39A
TIC39A by Texas Instruments is a single SCR with a max on-state current of 2A and non-repetitive peak on-state current of 20A. It has a trigger voltage of 1V and is ideal for applications requiring high power control in industrial settings.
VS-VSKU91/04
Vishay Intertechnology
SCR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
VS-25TTS12STRL-M3
VS-25TTS12STRL-M3 by Vishay Intertechnology is a Silicon Controlled Rectifier with 1200V peak reverse voltage, 25A RMS on-state current, and 45mA DC gate trigger current. Ideal for applications requiring SCR technology in compact spaces with surface mount capability.
2N6565
Littelfuse
SCR; Package Style (Meter): CYLINDRICAL; Surface Mount: NO; Terminal Position: BOTTOM; Configuration: SINGLE; Case Connection: ISOLATED;
JANTX2N2324A
Defense Logistics Agency
JANTX2N2324A by Defense Logistics Agency is a single SCR with max DC gate trigger current of 75mA. It has a metal package, cylindrical shape, and wire terminals. Ideal for military applications meeting MIL-19500/276F standard.
MCO50-16IO1
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: SINGLE; Case Connection: ISOLATED;
2N5062
Harris Semiconductor
SCR; Surface Mount: NO; Non Repetitive Peak On-state Current: 10 A; Maximum DC Gate Trigger Voltage: .8 V; Maximum DC Gate Trigger Current: .2 mA; Maximum Leakage Current: .01 mA;
SKNH91/12E
Semikron International
SKNH91/12E by Semikron International is a Silicon Controlled Rectifier (SCR) with a max DC Gate Trigger Current of 150 mA. It has a Non Repetitive Peak On-state Current of 2000 A and can handle a Max On-state Current of 95 A. This SCR is commonly used in applications that require high current switching capabilities.
2N1597
2N1597 by Texas Instruments is a single SCR with 10mA DC gate trigger current, 15A non-repetitive peak on-state current, and 1.6A max on-state current. It is used in applications requiring high power control such as motor drives and industrial heating systems due to its robust design and reliable performance.
SK70DT16
SK70DT16 by Semikron International is a 3-phase bridge SCR with 1600V repetitive peak reverse voltage and 68A max RMS on-state current. Ideal for applications requiring high power control such as industrial motor drives, power supplies, and electric vehicle charging systems.
2N1595
Artesyn Technologies
SCR; Surface Mount: NO; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum On-state Voltage: 2 V; Maximum DC Gate Trigger Voltage: 3 V;
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TDB6HK95N16LOFHOSA1
Infineon Technologies
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: 3 PHASE BRIDGE; Case Connection: ISOLATED;
Eupec & Kg
TDB6C95N16LOF
Silicon Controlled Rectifiers;
TDB6HK104N16RR
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Maximum DC Gate Trigger Current: 150 mA; No. of Elements: 3; Maximum Operating Temperature: 125 Cel; Non Repetitive Peak On-state Current: 650 A;
TDB6HK104N16RROF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Maximum DC Gate Trigger Voltage: 2.5 V; Maximum On-state Current: 104 A; Repetitive Peak Reverse Voltage: 1600 V; Maximum Operating Temperature: 125 Cel;
TDB6HK124N16RR
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED WITH BUILT-IN IGBT; Minimum Operating Temperature: -40 Cel;
TDB6HK124N16RRBOSA1
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED WITH BUILT-IN IGBT; Package Shape: RECTANGULAR;
TDB6HK124N16RRBPSA1
SCR; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TDB6HK124N16RROF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; No. of Elements: 3; Maximum Leakage Current: 10 mA; Repetitive Peak Reverse Voltage: 1600 V; Maximum Operating Temperature: 125 Cel;
TDB6HK205N10KOF
SCR; Configuration: 3 PHASE BRIDGE, FULL-CONTROLLED CONVERTER; Repetitive Peak Reverse Voltage: 1000 V; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel; Maximum On-state Voltage: 1.64 V;
TDB6HK205N12LOF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Maximum Operating Temperature: 125 Cel; Maximum On-state Current: 208 A; Maximum DC Gate Trigger Voltage: 2.5 V; Maximum Holding Current: 200 mA;
TDB6HK205N14LOF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; No. of Elements: 3; Repetitive Peak Reverse Voltage: 1400 V; Maximum On-state Voltage: 1.64 V; Maximum Leakage Current: 20 mA;
TDB6HK205N16LOF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Minimum Operating Temperature: -40 Cel; No. of Elements: 3; Maximum Holding Current: 200 mA; Repetitive Peak Reverse Voltage: 1600 V;
TDB6HK205N18LOF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Maximum On-state Voltage: 1.64 V; Maximum DC Gate Trigger Voltage: 2.5 V; Minimum Operating Temperature: -40 Cel; Maximum Leakage Current: 20 mA;
TDB6HK74N16RR
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Maximum Holding Current: 200 mA; Maximum Operating Temperature: 125 Cel; Non Repetitive Peak On-state Current: 500 A; Maximum DC Gate Trigger Voltage: 2.5 V;
TDB6HK95N16LOF
TDB6HK74N16RRKOF
SCR; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED CONVERTER, COMMON CATHODE; Maximum DC Gate Trigger Current: 150 mA; Maximum Holding Current: 200 mA; Maximum On-state Current: 45 A; Non Repetitive Peak On-state Current: 500 A;
SCR; Package Style (Meter): FLANGE MOUNT; Surface Mount: NO; Terminal Position: UPPER; Configuration: 3 PHASE BRIDGE, HALF-CONTROLLED WITH BUILT-IN IGBT AND THERMISTOR; Case Connection: ISOLATED;
Supply Digital Components
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