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TD250N16KOF

Infineon Technologies

TD250N16KOF by Infineon Technologies

TD250N16KOF by Infineon Technologies is a SCR with 200mA DC Gate Trigger Current, 7000A Non Repetitive Peak On-state Current, and 1600V Repetitive Peak Reverse Voltage. It is used in applications requiring high current switching capabilities such as industrial power control systems.

Median Price

$172.640

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$172.640

100+ parts

$164.200

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81

$172.640

$164.200

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 575 parts In-Stock

1+ parts

$149.207

100+ parts

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575

$149.207

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Vyrian

USA . 497 parts In-Stock

1+ parts

$157.060

100+ parts

-

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497

$157.060

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Forefront Electronics and Design

USA . 7 parts In-Stock

1+ parts

$205.430

100+ parts

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7

$205.430

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

1+ parts

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100

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Tech-Mark Corp

USA . 12 parts In-Stock

1+ parts

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 482 parts In-Stock

1+ parts

$3.272

100+ parts

$3.141

1k+ parts

$3.010

10k+ parts

-

482

$3.272

$3.141

$3.010

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Andel Nordic

Denmark . 1,574 parts In-Stock

1+ parts

$40.550

100+ parts

-

1k+ parts

$28.386

10k+ parts

$28.386

1,574

$40.550

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$28.386

$28.386

Corphita

USA . 941 parts In-Stock

1+ parts

$141.354

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941

$141.354

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Perfect Parts

USA . 60 parts In-Stock

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60

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Overview

Enhance your electrical systems with the TD250N16KOF by Infineon Technologies, a top-tier manufacturer known for quality and reliability. As a Silicon Controlled Rectifier, this product offers unmatched performance and durability in various applications. With a maximum DC Gate Trigger Current of 200 mA and a Non Repetitive Peak On-state Current of 7000 A, this SCR is designed to handle high-power requirements with ease. Trust in the value and benefits that this product brings, from its superior construction to its efficient operation. Upgrade your systems today with the TD250N16KOF for optimal performance and peace of mind.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 200 mA

Allows for efficient and reliable gate triggering, ensuring proper operation of the SCR.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and saves space by eliminating the need for an external diode.

Non Repetitive Peak On-state Current: 7000 A

High peak current capability allows the SCR to handle large transient currents, making it suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular package shape offers easy mounting and installation in various equipment and systems.

Maximum On-state Current: 250 A

Handles moderate to high continuous current levels, making it versatile for different load requirements.

Quick Connects Description: G-GR

Quick connects facilitate easy and secure connections, improving installation efficiency.

Maximum Leakage Current: 50 mA

Low leakage current ensures minimal power loss and enhanced energy efficiency.

Repetitive Peak Reverse Voltage: 1600 V

High reverse voltage capability allows for reliable and safe operation in reverse-biased conditions.

No. of Terminals: 5

Provides multiple connection points for enhanced versatility in circuit configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount design enables secure and stable mounting in a variety of applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance consistency under varying environmental conditions.

Trigger Device Type: SCR

SCR technology offers high reliability and efficiency in controlling power flow in circuits.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both extreme cold and hot environments.

Terminal Position: UPPER

Upper terminal position facilitates easy access and connection in circuit layouts.

Maximum RMS On-state Current: 410 A

High RMS current rating ensures efficient and reliable performance in continuous current flow applications.

Maximum DC Gate Trigger Voltage: 2 V

Low gate trigger voltage allows for precise and efficient triggering of the SCR.

Case Connection: ISOLATED

Isolated case connection enhances safety and protects against electrical hazards.

Repetitive Peak Off-state Voltage: 1600 V

High off-state voltage rating ensures reliable isolation and protection in off-state conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 1000 V/us

High critical rate of rise ensures fast response to voltage changes, making the SCR suitable for rapid switching applications.

Maximum Holding Current: 300 mA

Holding current specification ensures stable operation and prevents unintended turn-off in the SCR.

Screw Terminals Description: A-K-AK

Screw terminals provide secure and durable connections for reliable performance in various applications.

Nominal Circuit Commutated Turn-off Time: 250 us

Fast turn-off time allows for efficient switching and control, enhancing overall system performance.

Reference Standard: UL RECOGNIZED

UL recognized certification indicates compliance with safety and quality standards, ensuring reliability and performance.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TD250N16KOF attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Case Connection:

Nominal Circuit Commutated Turn-off Time:

250 us

Minimum Critical Rate of Rise of Off-state Voltage:

1000 V/us

Maximum DC Gate Trigger Current:

200 mA

Maximum DC Gate Trigger Voltage:

2 V

Quick Connects Description:

G-GR

Screw Terminals Description:

A-K-AK

Maximum Holding Current:

300 mA

JESD-30 Code:

R-XUFM-X5

Maximum Leakage Current:

50 mA

Non Repetitive Peak On-state Current:

7000 A

No. of Elements:

1

No. of Terminals:

5

Maximum On-state Current:

250 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

410 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

1600 V

Repetitive Peak Reverse Voltage:

1600 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

TD250N16KOF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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