Loading...

TC387QP160F300SADLXUMA1

Infineon Technologies

TC387QP160F300SADLXUMA1 by Infineon Technologies

Infineon's TC387QP160F300SADLXUMA1 is a 32-bit microcontroller with 160 MHz clock frequency, 292 terminals, and flash ROM programmability. Ideal for applications requiring high-speed processing and multiple ADC/DMA channels in a compact square package with low profile and fine pitch grid array.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,382

-

-

-

-

Digiode

USA . 843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

843

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$14.194

100+ parts

-

1k+ parts

-

10k+ parts

-

578

$14.194

-

-

-

Modulus Dynamics

Lithuania . 3,089 parts In-Stock

1+ parts

$24.669

100+ parts

$23.682

1k+ parts

$22.695

10k+ parts

-

3,089

$24.669

$23.682

$22.695

-

Ampacity Inc.

Singapore . 1,149 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,149

$29.000

-

-

-

Component Stockers USA

USA . 624 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

624

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,961

-

-

-

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Microchip USA

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

Corphita

USA . 281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

281

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Infineon Technologies with the TC387QP160F300SADLXUMA1 microcontroller. This cutting-edge device offers a myriad of applications in various industries, providing customers with unmatched performance and efficiency. The advanced features, superior packaging, and high-speed capabilities make it the ideal choice for those seeking top-of-the-line technology. Trust in Infineon Technologies to deliver innovative solutions that exceed expectations and propel your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.63 V

Operating at a maximum supply voltage of 3.63V provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape helps optimize space utilization on the PCB layout and allows for easier placement and routing of other components.

Bit Size: 32

32-bit processing capability enables higher computational power and performance, making the microcontroller suitable for advanced applications.

No. of Terminals: 292

Having 292 terminals provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density packaging, allowing for more functionality in a compact form factor.

Minimum Supply Voltage: 2.97 V

Operating at a minimum supply voltage of 2.97V ensures reliable performance even under low power conditions, making the microcontroller suitable for energy-efficient applications.

Terminal Finish: TIN SILVER

TIN SILVER terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, expanding the range of inputs and outputs that the microcontroller can interface with.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer and processing, improving overall system performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly, ensuring reliable connections and reducing the risk of damage.

Maximum Seated Height: 1.7 mm

Low maximum seated height helps reduce the overall profile of the microcontroller on the PCB, optimizing space usage and allowing for more compact designs.

Width: 17 mm

With a width of 17mm, the microcontroller can fit comfortably within standard PCB layouts and enclosures, making it easier to integrate into various systems.

Maximum Clock Frequency: 160 MHz

Operating at a maximum clock frequency of 160MHz allows for high-speed processing and execution of instructions, enhancing the overall performance of the microcontroller.

Length: 17 mm

With a length of 17mm, the microcontroller maintains a balanced form factor, making it suitable for a wide range of applications without sacrificing performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: BALL

Ball terminal form offers reliable and robust connections, ensuring secure solder joints and reducing the risk of signal interference or loss.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V provides stable and consistent power delivery, ensuring reliable operation of the microcontroller in various operating conditions.

PWM Channels: YES

Support for PWM channels enables precise control of analog outputs, allowing for smooth and accurate modulation of signals, essential for many applications.

ROM Programmability: FLASH

ROM programmability using flash technology allows for easy firmware updates and customization, enhancing flexibility and adaptability of the microcontroller to different requirements.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the microcontroller offers fine-scale connectivity options, enabling high-density layouts and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent any moisture-related damage during assembly and operation.

Speed: 300 rpm

Operating at a speed of 300rpm, the microcontroller offers fast and efficient processing capabilities, suitable for real-time and high-speed applications.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, the microcontroller can accommodate a wide range of firmware and software programs, enhancing its versatility and functionality.

Technical Specifications

Microcontrollers TC387QP160F300SADLXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE WITH 5 V NOMINAL

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC387QP160F300SADLXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5