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TC387QP160F300SAEKXUMA1

Infineon Technologies

TC387QP160F300SAEKXUMA1 by Infineon Technologies

Infineon's TC387QP160F300SAEKXUMA1 is a 32-bit microcontroller with 292 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features ISO 26262 screening, flash ROM programmability, and PWM channels for precise control in demanding environments.

Median Price

$145.944

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 27 parts In-Stock

1+ parts

$104.350

100+ parts

-

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-

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27

$104.350

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Verical

USA . 27 parts In-Stock

1+ parts

$145.944

100+ parts

$126.431

1k+ parts

-

10k+ parts

-

27

$145.944

$126.431

-

-

Farnell

UK . 538 parts In-Stock

1+ parts

$168.260

100+ parts

-

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538

$168.260

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-

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Element14

Singapore . 538 parts In-Stock

1+ parts

-

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538

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Distributors (In-Stock)

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Digiode

USA . 332 parts In-Stock

1+ parts

$122.816

100+ parts

-

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332

$122.816

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$158.760

100+ parts

-

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100

$158.760

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-

-

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Rutronik

Germany . 2,000 parts In-Stock

1+ parts

-

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$36.760

10k+ parts

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2,000

-

-

$36.760

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Vyrian

USA . 164 parts In-Stock

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164

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,445 parts In-Stock

1+ parts

$23.116

100+ parts

$22.191

1k+ parts

$21.267

10k+ parts

-

3,445

$23.116

$22.191

$21.267

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Aztec Data Supply Inc.

USA . 1,540 parts In-Stock

1+ parts

$29.090

100+ parts

-

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1,540

$29.090

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$36.751

100+ parts

$34.914

1k+ parts

$34.914

10k+ parts

-

3,000

$36.751

$34.914

$34.914

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Corohmni

South Africa . 354 parts In-Stock

1+ parts

$43.707

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354

$43.707

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Ampacity Inc.

Singapore . 319 parts In-Stock

1+ parts

$93.920

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319

$93.920

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Semicontronic

India . 263 parts In-Stock

1+ parts

$93.920

100+ parts

$91.572

1k+ parts

$91.102

10k+ parts

-

263

$93.920

$91.572

$91.102

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Corphita

USA . 551 parts In-Stock

1+ parts

$116.352

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551

$116.352

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Continental Prestige Electronics

USA . 954 parts In-Stock

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$118.400

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954

$118.400

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Microchip USA

USA . 2,807 parts In-Stock

1+ parts

$133.360

100+ parts

$129.800

1k+ parts

$128.020

10k+ parts

$126.250

2,807

$133.360

$129.800

$128.020

$126.250

Netroflash

USA . 100 parts In-Stock

1+ parts

$158.760

100+ parts

-

1k+ parts

$150.822

10k+ parts

$147.647

100

$158.760

-

$150.822

$147.647

Argo Parts USA

USA . 4,542 parts In-Stock

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4,542

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Robosynatics

Brazil . 1,429 parts In-Stock

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1,429

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Lucentia Tech

USA . 1,429 parts In-Stock

1+ parts

-

100+ parts

$52.163

1k+ parts

$51.099

10k+ parts

$51.099

1,429

-

$52.163

$51.099

$51.099

Overview

Upgrade your automotive electronics with the cutting-edge TC387QP160F300SAEKXUMA1 microcontroller by Infineon Technologies. With its advanced CMOS technology and ISO 26262 screening level, this microcontroller offers unmatched reliability and performance for a wide range of applications. From PWM channels to ADC and DMA capabilities, this versatile chip provides the flexibility you need to create innovative solutions. Trust in Infineon's reputation for quality and experience the value and advantages this product brings to your projects. Drive your designs forward with the TC387QP160F300SAEKXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.375 V

Provides a safe operating voltage range for the microcontroller, ensuring stable performance.

Screening Level: ISO 26262

Compliance with this safety standard indicates reliability and quality, making it a trustworthy choice for automotive applications.

Bit Size: 32

High bit size allows for complex processing capabilities and efficient handling of data.

No. of Terminals: 292

Ample number of terminals for connectivity and interfacing with external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with high terminal density, suitable for space-constrained applications.

Minimum Supply Voltage: 1.125 V

Low minimum supply voltage allows for energy-efficient operation and extended battery life.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures the microcontroller can withstand harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, providing optimized functionality for embedded systems.

Technical Specifications

Microcontrollers TC387QP160F300SAEKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

100 INPUT LINES OF ADC

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

151

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

1.125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC387QP160F300SAEKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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