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TC387QP160F300SAELXUMA1

Infineon Technologies

TC387QP160F300SAELXUMA1 by Infineon Technologies

Infineon's TC387QP160F300SAELXUMA1 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 512K data EEPROM size. Ideal for automotive applications requiring ISO 26262 screening, it offers CAN, Ethernet, I2C connectivity with low power mode and on-chip cache.

Median Price

$45.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 455 parts In-Stock

1+ parts

$45.070

100+ parts

$42.370

1k+ parts

$38.310

10k+ parts

-

455

$45.070

$42.370

$38.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 991 parts In-Stock

1+ parts

$42.816

100+ parts

-

1k+ parts

-

10k+ parts

-

991

$42.816

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$111.827

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$111.827

-

-

-

Vyrian

USA . 7,416 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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7,416

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$8.903

100+ parts

-

1k+ parts

-

10k+ parts

-

212

$8.903

-

-

-

Modulus Dynamics

Lithuania . 4,557 parts In-Stock

1+ parts

$22.627

100+ parts

$21.722

1k+ parts

$20.817

10k+ parts

-

4,557

$22.627

$21.722

$20.817

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Ampacity Inc.

Singapore . 358 parts In-Stock

1+ parts

$38.310

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$38.310

-

-

-

Corphita

USA . 411 parts In-Stock

1+ parts

$40.563

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$40.563

-

-

-

Component Stockers USA

USA . 577 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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577

$99.990

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-

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Continental Prestige Electronics

USA . 6,180 parts In-Stock

1+ parts

$111.827

100+ parts

-

1k+ parts

-

10k+ parts

$109.591

6,180

$111.827

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-

$109.591

Netroflash

USA . 100 parts In-Stock

1+ parts

$111.827

100+ parts

-

1k+ parts

-

10k+ parts

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100

$111.827

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-

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Microchip USA

USA . 2,834 parts In-Stock

1+ parts

$190.512

100+ parts

-

1k+ parts

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10k+ parts

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2,834

$190.512

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-

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Argo Parts USA

USA . 3,438 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,438

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Overview

Unlock the power of innovation with the TC387QP160F300SAELXUMA1 by Infineon Technologies. Crafted with precision and expertise, this microcontroller offers unmatched quality and reliability for a wide range of applications. From automotive to industrial sectors, this product delivers exceptional performance, efficiency, and flexibility. Seamlessly integrated features like integrated cache and peripherals ensure a seamless user experience. Experience the next level of technology with the TC387QP160F300SAELXUMA1 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Integrated Cache: YES

The integrated cache helps improve data access speeds, enhancing the overall performance of the microcontroller.

Maximum Supply Voltage: 1.375 V

The higher maximum supply voltage allows for flexibility in power input and compatibility with different power sources.

On Chip Data RAM Width: 8

The 8-bit width of the on-chip data RAM enables efficient data processing and storage capabilities.

Screening Level: ISO 26262

Compliance with ISO 26262 ensures high levels of functional safety, making the microcontroller suitable for automotive and industrial applications.

Width: 17 mm

The compact width of 17mm allows for space-saving installation in electronic devices with limited space.

Connectivity: CAN(12), ETHERNET, I2C(2), PSI5(4), PSI5-S, QSPI(5)

The multiple connectivity options available make this microcontroller versatile and suitable for a wide range of communication protocols and interfaces.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy updating and customization of software, making the microcontroller adaptable to changing requirements.

Technical Specifications

Microcontrollers TC387QP160F300SAELXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC38X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of External Interrupts:

1

No. of Serial I/Os:

16

No. of Terminals:

292

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

196608

ROM Words:

10485760

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Current:

1100 mA

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

1.125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

512K

Connectivity:

CAN(12), ETHERNET, I2C(2), PSI5(4), PSI5-S, QSPI(5)

Peripherals:

TIMER(9)

Trade Compliance

TC387QP160F300SAELXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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