Loading...

TC212L8F133NACKXUMA1

Infineon Technologies

TC212L8F133NACKXUMA1 by Infineon Technologies

Infineon's TC212L8F133NACKXUMA1 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 12-Ch 12-Bit ADCs. Ideal for automotive applications, it offers low power mode, ASCLIN(2), CAN(3), QSPI(4) connectivity, and DMA channels for efficient data transfer. With a wide temperature range (-40 to 125 °C), this device is suitable for various automotive control systems.

Median Price

$12.665

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,780 parts In-Stock

1+ parts

$12.000

100+ parts

$7.220

1k+ parts

$6.930

10k+ parts

$6.900

1,780

$12.000

$7.220

$6.930

$6.900

Newark

USA . 1,794 parts In-Stock

1+ parts

$13.330

100+ parts

$9.000

1k+ parts

$8.400

10k+ parts

-

1,794

$13.330

$9.000

$8.400

-

Verical

USA . 3,774 parts In-Stock

1+ parts

-

100+ parts

$9.150

1k+ parts

$8.188

10k+ parts

$7.713

3,774

-

$9.150

$8.188

$7.713

Rochester

USA . 3,774 parts In-Stock

1+ parts

-

100+ parts

$7.320

1k+ parts

$6.550

10k+ parts

$6.170

3,774

-

$7.320

$6.550

$6.170

Farnell

UK . 1,800 parts In-Stock

1+ parts

-

100+ parts

$31.186

1k+ parts

-

10k+ parts

-

1,800

-

$31.186

-

-

Element14

Singapore . 1,800 parts In-Stock

1+ parts

-

100+ parts

$32.148

1k+ parts

-

10k+ parts

-

1,800

-

$32.148

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 761 parts In-Stock

1+ parts

$7.724

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$7.724

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$32.053

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$32.053

-

-

-

Rutronik

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Vyrian

USA . 1,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,442

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,746 parts In-Stock

1+ parts

$6.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,746

$6.910

-

-

-

Semicontronic

India . 1,724 parts In-Stock

1+ parts

$6.910

100+ parts

$6.737

1k+ parts

$6.703

10k+ parts

-

1,724

$6.910

$6.737

$6.703

-

Corphita

USA . 877 parts In-Stock

1+ parts

$7.317

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$7.317

-

-

-

Component Stockers USA

USA . 4,717 parts In-Stock

1+ parts

$29.920

100+ parts

$10.230

1k+ parts

$9.820

10k+ parts

-

4,717

$29.920

$10.230

$9.820

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$32.053

100+ parts

$31.412

1k+ parts

-

10k+ parts

-

500

$32.053

$31.412

-

-

Aztec Data Supply Inc.

USA . 2,704 parts In-Stock

1+ parts

$34.680

100+ parts

-

1k+ parts

-

10k+ parts

-

2,704

$34.680

-

-

-

Corohmni

South Africa . 159 parts In-Stock

1+ parts

$40.155

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$40.155

-

-

-

Microchip USA

USA . 1,976 parts In-Stock

1+ parts

$60.860

100+ parts

$59.800

1k+ parts

$59.270

10k+ parts

$58.740

1,976

$60.860

$59.800

$59.270

$58.740

Modulus Dynamics

Lithuania . 1,444 parts In-Stock

1+ parts

$84.792

100+ parts

$81.400

1k+ parts

$78.009

10k+ parts

-

1,444

$84.792

$81.400

$78.009

-

GreenTree Electronics

Israel . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,000

-

-

-

-

iodParts Technologies Inc.

India . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Argo Parts USA

USA . 2,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,428

-

-

-

-

Continental Prestige Electronics

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the TC212L8F133NACKXUMA1 microcontroller from Infineon Technologies. Designed with top-quality materials and precision engineering, this device offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial use, this microcontroller delivers superior functionality and efficiency, making it the perfect choice for your next project. Experience the benefits of advanced features, low power consumption, and seamless connectivity, all packed into a compact and versatile package. Upgrade your systems today with the TC212L8F133NACKXUMA1 and take your innovation to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.43 V

Allows for a higher supply voltage, giving flexibility in power requirements for different projects.

Bit Size: 32

Having a 32-bit architecture allows for processing larger amounts of data and executing more complex tasks efficiently.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability even in harsh environments.

ADC Channels: YES

The presence of ADC channels allows for analog inputs to be converted to digital signals for processing, expanding the range of applications.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 1048576

The large ROM size allows for storing a significant amount of program instructions and data, facilitating complex program execution.

DMA Channels: 16

Having 16 DMA channels provides more flexibility and efficiency in managing data transfer tasks, enhancing system performance.

Connectivity: ASCLIN(2), CAN(3), QSPI(4)

Multiple connectivity options such as ASCLIN, CAN, and QSPI enable interfacing with different communication protocols and devices, making the microcontroller versatile.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

Technical Specifications

Microcontrollers TC212L8F133NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

59

No. of Terminals:

80

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.48SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

1048576

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

133 rpm

Maximum Supply Current:

99 mA

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

96K

Connectivity:

ASCLIN(2), CAN(3), QSPI(4)

Peripherals:

DMA(16), POR, TIMER(2)

Analog To Digital Convertors:

12-Ch 12-Bit(2)

Trade Compliance

TC212L8F133NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4