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TC213L8F133NACKXUMA1

Infineon Technologies

TC213L8F133NACKXUMA1 by Infineon Technologies

Infineon's TC213L8F133NACKXUMA1 is a 32-bit microcontroller with 524288 ROM words, 57344 RAM bytes, and a max clock frequency of 133 MHz. Ideal for automotive applications, it features peripherals like DMA(16), RTC, WDT, and connectivity options such as CAN(3).

Median Price

$9.613

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 886 parts In-Stock

1+ parts

$13.540

100+ parts

$9.163

1k+ parts

$8.375

10k+ parts

-

886

$13.540

$9.163

$8.375

-

Rochester

USA . 7,637 parts In-Stock

1+ parts

-

100+ parts

$7.690

1k+ parts

$6.880

10k+ parts

$6.470

7,637

-

$7.690

$6.880

$6.470

Verical

USA . 6,577 parts In-Stock

1+ parts

-

100+ parts

$9.613

1k+ parts

$8.600

10k+ parts

$8.088

6,577

-

$9.613

$8.600

$8.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 390 parts In-Stock

1+ parts

$8.122

100+ parts

-

1k+ parts

-

10k+ parts

-

390

$8.122

-

-

-

Flip Electronics

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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33,000

-

-

-

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Vyrian

USA . 8,749 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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8,749

-

-

-

-

Bristol Electronics

USA . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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915

-

-

-

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Nova Conductors

Japan . 71 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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71

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 781 parts In-Stock

1+ parts

$7.695

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$7.695

-

-

-

Component Stockers USA

USA . 660 parts In-Stock

1+ parts

$35.760

100+ parts

$28.170

1k+ parts

-

10k+ parts

-

660

$35.760

$28.170

-

-

Modulus Dynamics

Lithuania . 3,227 parts In-Stock

1+ parts

$46.261

100+ parts

$44.411

1k+ parts

$42.560

10k+ parts

-

3,227

$46.261

$44.411

$42.560

-

Microchip USA

USA . 2,774 parts In-Stock

1+ parts

$53.850

100+ parts

$53.090

1k+ parts

$52.700

10k+ parts

$52.320

2,774

$53.850

$53.090

$52.700

$52.320

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$77.703

100+ parts

-

1k+ parts

-

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254

$77.703

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-

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Argo Parts USA

USA . 4,600 parts In-Stock

1+ parts

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100+ parts

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4,600

-

-

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Continental Prestige Electronics

USA . 2,530 parts In-Stock

1+ parts

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100+ parts

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2,530

-

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Discover the unparalleled quality and reliability of the TC213L8F133NACKXUMA1 microcontroller by Infineon Technologies. This cutting-edge device offers a wide range of applications in automotive technology, IoT, industrial control systems, and more. With advanced features like ADC and DMA channels, along with a high clock frequency of 133 MHz, this microcontroller delivers exceptional performance. Trust in the expertise of Infineon Technologies to provide you with a product that exceeds expectations and brings value to your projects. Elevate your designs with the TC213L8F133NACKXUMA1 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.43 V

A high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities.

No. of Terminals: 100

A higher number of terminals offer more connectivity options.

ADC Channels: YES

Integrated ADC channels enable analog signal processing.

DMA Channels: YES

DMA channels help in efficient data transfer without CPU intervention.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data.

Maximum Clock Frequency: 133 MHz

High clock frequency enables fast data processing and response times.

RAM Bytes: 57344

Sufficient RAM capacity for temporary data storage during processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Connectivity: CAN(3)

CAN connectivity enables communication with various automotive systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating of firmware.

Technical Specifications

Microcontrollers TC213L8F133NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

NUMBER OF ADC MODULES : 2, A/D INPUT LINES 24

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

133 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

78

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

57344

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

133 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3)

Peripherals:

DMA(16), RTC, WDT

Trade Compliance

TC213L8F133NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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