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STK12C68-SF45

Infineon Technologies

STK12C68-SF45 by Infineon Technologies

STK12C68-SF45 by Infineon Technologies is a 8Kx8 non-volatile SRAM with 65536 bit memory density. It operates at 5V, has an access time of 45ns, and features a 3-STATE output. Suitable for applications requiring fast and reliable data storage in small outline packages.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

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Vyrian

USA . 7,801 parts In-Stock

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USA . 6,068 parts In-Stock

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Bristol Electronics

USA . 1,788 parts In-Stock

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Digiode

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Chip Stock

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Nova Conductors

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Corohmni

South Africa . 749 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,693 parts In-Stock

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Modulus Dynamics

Lithuania . 4,075 parts In-Stock

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$4.802

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$4.610

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$4.418

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Ampacity Inc.

Singapore . 7,737 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,763 parts In-Stock

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Microchip USA

USA . 5,799 parts In-Stock

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Kepictronics

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Argo Parts USA

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Aranea Global

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Corphita

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Continental Prestige Electronics

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Overview

Unlock limitless possibilities with the STK12C68-SF45 from Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality SRAM products that cater to a wide range of applications. The STK12C68-SF45 offers unparalleled value with its non-volatile memory technology, 8Kx8 organization, and low standby voltage. Whether you're working on embedded systems, telecommunications, or industrial controls, this versatile memory IC provides reliable performance and exceptional data integrity. Elevate your projects with the STK12C68-SF45 and experience the difference Infineon Technologies brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation on a circuit board, saving space and simplifying assembly processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in data transfer and communication, enabling efficient performance in various applications.

Nominal Supply Voltage: 5V

Operates at a common voltage level, ensuring compatibility with standard power sources and reducing the need for additional voltage regulation.

Memory Density: 65536 bit

High memory density allows for storing a large amount of data in a compact space, making the product suitable for applications requiring extensive memory storage.

Maximum Access Time: 45 ns

Fast access time ensures quick retrieval of data, enhancing the overall performance and responsiveness of the product in data-intensive tasks.

Technical Specifications

SRAM STK12C68-SF45 attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

Length:

18.3895 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

2.794 mm

Maximum Standby Current:

.0015 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

65 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

8.6865 mm

Trade Compliance

STK12C68-SF45 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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