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SPW55N80C3

Infineon Technologies

SPW55N80C3 by Infineon Technologies

SPW55N80C3 by Infineon is a N-CHANNEL FET with 800V DS breakdown voltage, 0.085 ohm RDS(on), and 150A IDM. It's used for switching applications due to its single configuration with built-in diode and enhancement mode operation. The transistor has a package style of flange mount and operates on metal-oxide semiconductor technology.

Median Price

$16.655

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$14.830

100+ parts

$9.920

1k+ parts

$9.910

10k+ parts

-

14

$14.830

$9.920

$9.910

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Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$18.480

1k+ parts

$18.136

10k+ parts

-

480

-

$18.480

$18.136

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 280 parts In-Stock

1+ parts

$9.887

100+ parts

$5.791

1k+ parts

$4.801

10k+ parts

-

280

$9.887

$5.791

$4.801

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Vyrian

USA . 312 parts In-Stock

1+ parts

$13.198

100+ parts

-

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-

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312

$13.198

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-

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Digiode

USA . 749 parts In-Stock

1+ parts

$15.865

100+ parts

-

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749

$15.865

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-

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Rutronik

Germany . 330 parts In-Stock

1+ parts

-

100+ parts

$9.380

1k+ parts

$7.680

10k+ parts

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330

-

$9.380

$7.680

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Nova Conductors

Japan . 17 parts In-Stock

1+ parts

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17

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Semtec, LLC

USA . 1 parts In-Stock

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1

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 23,120 parts In-Stock

1+ parts

$0.744

100+ parts

$0.714

1k+ parts

$0.684

10k+ parts

-

23,120

$0.744

$0.714

$0.684

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Ampacity Inc.

Singapore . 399 parts In-Stock

1+ parts

$11.220

100+ parts

-

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399

$11.220

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Corphita

USA . 135 parts In-Stock

1+ parts

$15.030

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-

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135

$15.030

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CoreStaff

Japan . 480 parts In-Stock

1+ parts

$18.321

100+ parts

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480

$18.321

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A-Z Elektronik GmbH

Germany . 5,057 parts In-Stock

1+ parts

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5,057

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of cutting-edge technology with the SPW55N80C3 by Infineon Technologies. Designed to deliver exceptional performance and reliability, this N-CHANNEL Power Field Effect Transistor is perfect for a wide range of applications in the switching industry. With a minimum DS Breakdown Voltage of 800V and a maximum Pulsed Drain Current of 150A, this transistor offers unmatched efficiency and durability. Trust in Infineon's reputation for excellence and experience the value and benefits that the SPW55N80C3 can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher electron mobility compared to P-channel transistors, allowing for faster switching speeds and lower ON resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, increasing the efficiency and reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds, making it ideal for power management and control.

Minimum DS Breakdown Voltage: 800 V

The high breakdown voltage allows for operation in high voltage applications, providing reliable performance and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape offers easy mounting and efficient use of space, making it suitable for compact designs and dense PCB layouts.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering, ensuring reliable electrical contact in various circuit configurations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage to turn on, offering better control and protection against accidental activations.

Maximum Pulsed Drain Current (IDM): 150 A

The high pulsed drain current rating allows for handling large transient currents, making it suitable for applications requiring high peak power handling capabilities.

Avalanche Energy Rating (EAS): 2150 mJ

The high avalanche energy rating indicates the FET's ability to handle energy spikes and protect against breakdown during high voltage transients.

No. of Terminals: 3

The 3-terminal design offers easy integration into circuit layouts and provides necessary connections for gate, source, and drain terminals.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and heat dissipation, maintaining optimal performance and reliability in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low ON resistance and high switching speeds, making it ideal for high-frequency and high-power applications that require efficient power management.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency in electronic devices, ensuring stable performance and long-term reliability.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring secure connections and longevity in various operating environments.

Maximum Drain-Source On Resistance: 0.085 ohm

The low ON resistance reduces power loss and heat generation, improving the efficiency and overall performance of the transistor in high current applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and PCB layout, ensuring proper orientation and connections for reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) SPW55N80C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

2150 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

150 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPW55N80C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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