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SPW52N50C3

Infineon Technologies

SPW52N50C3 by Infineon Technologies

SPW52N50C3 by Infineon is a N-CHANNEL Power FET with 500V DS Breakdown Voltage and 156A IDM. Ideal for applications requiring high power dissipation, such as industrial motor drives or power supplies. Features include a built-in diode, 0.07 ohm RDS(on), and 1800mJ EAS rating.

Median Price

$10.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 3 parts In-Stock

1+ parts

$10.000

100+ parts

$7.500

1k+ parts

$6.500

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3

$10.000

$7.500

$6.500

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Vyrian

USA . 800 parts In-Stock

1+ parts

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800

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Digiode

USA . 543 parts In-Stock

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543

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 12,166 parts In-Stock

1+ parts

$0.595

100+ parts

$0.571

1k+ parts

$0.547

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12,166

$0.595

$0.571

$0.547

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AZTECH Wire

Italy . 873 parts In-Stock

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$9.821

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873

$9.821

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Ampacity Inc.

Singapore . 1,230 parts In-Stock

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$36.050

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$36.050

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Lixinc

USA . 14,260 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,554 parts In-Stock

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Argo Parts USA

USA . 3,153 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 629 parts In-Stock

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629

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Bastille Electronics

Australia . 450 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Corphita

USA . 12 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SPW52N50C3 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor boasts unparalleled quality and performance. From enhancing efficiency in industrial applications to optimizing power management in electronic devices, this product offers maximum reliability and durability. Experience the difference with the SPW52N50C3 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the FET, ensuring its durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower on-state resistance compared to P-channel FETs, making them a preferred choice for many applications.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage of 500V, this FET can handle high voltage applications with ease, providing robust protection against voltage spikes and surges.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration and simplifies circuit design, making this FET a convenient choice for applications requiring reverse polarity protection.

Maximum Pulsed Drain Current (IDM): 156 A

The high pulsed drain current rating of 156A allows this FET to handle short-duration high current events, making it suitable for applications with varying load requirements.

Avalanche Energy Rating (EAS): 1800 mJ

The high avalanche energy rating of 1800mJ indicates the FET's ability to withstand voltage spikes and transients, ensuring reliable operation in harsh environments.

Maximum Power Dissipation (Abs): 417 W

With a high power dissipation rating of 417W, this FET can handle high power levels without overheating, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.07 ohm

The low on-resistance of 0.07 ohm reduces power loss and improves efficiency in the circuit, making this FET ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) SPW52N50C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

1800 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

52 A

Maximum Drain Current (ID):

52 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

156 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

SPW52N50C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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