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SPW47N60CFD

Infineon Technologies

SPW47N60CFD by Infineon Technologies

SPW47N60CFD by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a single configuration with built-in diode, 115A Max IDM, and 0.083 ohm RDS(on). Ideal for high-power applications requiring efficient switching and high current handling capabilities.

Median Price

$16.415

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 349 parts In-Stock

1+ parts

$14.330

100+ parts

$9.100

1k+ parts

$7.890

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349

$14.330

$9.100

$7.890

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Chip1Stop

Japan . 180 parts In-Stock

1+ parts

$18.500

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$10.000

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180

$18.500

$10.000

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Maritex

Poland . 1,330 parts In-Stock

1+ parts

$10.254

100+ parts

$7.603

1k+ parts

$6.266

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1,330

$10.254

$7.603

$6.266

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Digiode

USA . 866 parts In-Stock

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$15.637

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866

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Forefront Electronics and Design

USA . 16 parts In-Stock

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$24.500

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$24.500

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Vyrian

USA . 109 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 100 parts In-Stock

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Zilex Electronics Inc.

Canada . 94 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Euro-Tech

UK . 51 parts In-Stock

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LWI Electronics Inc

India . 24 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 19,915 parts In-Stock

1+ parts

$1.153

100+ parts

$1.107

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$1.061

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19,915

$1.153

$1.107

$1.061

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AZTECH Wire

Italy . 722 parts In-Stock

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$9.639

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722

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Ampacity Inc.

Singapore . 106 parts In-Stock

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$13.990

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Corphita

USA . 192 parts In-Stock

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$14.814

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Lixinc

USA . 16,860 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

USA . 120 parts In-Stock

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Infinite Electronics LLP (Excess)

. 37 parts In-Stock

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Overview

Power up your projects with the SPW47N60CFD by Infineon Technologies. Manufactured with top-quality materials and cutting-edge technology, this N-CHANNEL Power Field Effect Transistor offers exceptional performance and reliability. Whether you're designing industrial equipment, automotive applications, or power supplies, this transistor's high breakdown voltage and low on-resistance provide unmatched efficiency and durability. Take your projects to the next level with the SPW47N60CFD and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them a preferred choice in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage, enhancing the reliability of the overall system.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage offers protection against voltage spikes and ensures the FET can handle high voltage applications.

Maximum Pulsed Drain Current (IDM): 115 A

The high pulsed drain current rating allows the FET to handle short-duration high current spikes, making it suitable for power applications.

Maximum Power Dissipation (Abs): 417 W

The high power dissipation rating ensures the FET can handle high power levels without overheating, maintaining stable performance.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the FET to operate in harsh environments without performance degradation.

Maximum Drain-Source On Resistance: 0.083 ohm

The low on-resistance of the FET results in minimal power loss and efficient operation in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) SPW47N60CFD attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH VOLTAGE

Avalanche Energy Rating (EAS):

1800 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

46 A

Maximum Drain Current (ID):

46 A

Maximum Drain-Source On Resistance:

.083 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

115 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

SPW47N60CFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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