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SPP15N60C3XK

Infineon Technologies

SPP15N60C3XK by Infineon Technologies

SPP15N60C3XK by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a max IDM of 45A and 0.28 ohm Drain-Source On Resistance, suitable for SWITCHING applications. This METAL-OXIDE SEMICONDUCTOR device has a built-in DIODE and operates in ENHANCEMENT MODE, making it ideal for high-power switching circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,487 parts In-Stock

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1,487

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Digiode

USA . 766 parts In-Stock

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766

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,216 parts In-Stock

1+ parts

$0.342

100+ parts

$0.328

1k+ parts

$0.315

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3,216

$0.342

$0.328

$0.315

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Aztec Data Supply Inc.

USA . 4,887 parts In-Stock

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$1.210

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Corohmni

South Africa . 228 parts In-Stock

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$1.244

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228

$1.244

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.415

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$1.288

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$1.160

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270

$1.415

$1.288

$1.160

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AZTECH Wire

Italy . 861 parts In-Stock

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$15.265

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861

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Ampacity Inc.

Singapore . 427 parts In-Stock

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$25.050

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427

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Andel Nordic

Denmark . 5,806 parts In-Stock

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$50.270

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$35.191

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$35.191

5,806

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$35.191

$35.191

Argo Parts USA

USA . 4,532 parts In-Stock

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Continental Prestige Electronics

USA . 3,071 parts In-Stock

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Corphita

USA . 140 parts In-Stock

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140

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the SPP15N60C3XK by Infineon Technologies. As a leader in the field of Power Field Effect Transistors, Infineon Technologies has crafted a product that offers unrivaled quality and reliability. Ideal for switching applications, this N-CHANNEL transistor provides a breakthrough in performance with its built-in diode configuration. Whether you're looking to optimize energy efficiency or enhance system functionality, the SPP15N60C3XK delivers exceptional value and benefits. Trust in Infineon Technologies to provide cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Highly durable and resistant to environmental factors, ensuring the longevity and reliability of the product.

Polarity or Channel Type: N-CHANNEL

Provides efficient performance and allows for a wide range of applications in electronic circuits.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage requirements, making it suitable for use in power electronics applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with integrated diode for protection against reverse current flow.

Transistor Application: SWITCHING

Designed for efficient switching operations, ideal for power management and control.

Maximum Pulsed Drain Current (IDM): 45 A

High current handling capability allows for reliable performance in demanding operating conditions.

Avalanche Energy Rating (EAS): 460 mJ

Can withstand high energy spikes, ensuring robustness and protection against power surges.

Maximum Drain-Source On Resistance: 0.28 ohm

Low on-resistance minimizes power loss and heat generation, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) SPP15N60C3XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

460 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

45 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPP15N60C3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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