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SPP11N80C3

Infineon Technologies

SPP11N80C3 by Infineon Technologies

SPP11N80C3 by Infineon Technologies is a N-CHANNEL Power FET with 800V DS Breakdown Voltage and 33A IDM. It features a built-in diode, operates in enhancement mode, and has a max power dissipation of 156W. Ideal for applications requiring high voltage and current handling capabilities in various electronic circuits.

Median Price

$2.393

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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RS (Exports)

UK . 467 parts In-Stock

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$2.393

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TME

Poland . 66 parts In-Stock

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$2.520

100+ parts

$1.530

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$1.240

10k+ parts

$1.220

66

$2.520

$1.530

$1.240

$1.220

Digiode

USA . 92 parts In-Stock

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$3.116

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Maritex

Poland . 10 parts In-Stock

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$5.336

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Vyrian

USA . 2,234 parts In-Stock

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Rutronik

Germany . 1,100 parts In-Stock

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$1.660

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$1.270

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Rebound Electronics

UK . 366 parts In-Stock

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Zilex Electronics Inc.

Canada . 300 parts In-Stock

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300

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ComSIT USA

USA . 267 parts In-Stock

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Sensible Micro Corp

USA . 122 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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R&J Components

USA . 38 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,237 parts In-Stock

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$0.730

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Modulus Dynamics

Lithuania . 14,041 parts In-Stock

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$1.118

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$1.073

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$1.029

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14,041

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Ampacity Inc.

Singapore . 2,092 parts In-Stock

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$2.030

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Corphita

USA . 590 parts In-Stock

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$2.952

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Futuretech Components

Singapore . 6,940 parts In-Stock

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Continental Prestige Electronics

USA . 3,876 parts In-Stock

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Argo Parts USA

USA . 1,672 parts In-Stock

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Formix International (Excess)

India . 1,204 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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GreenTree Electronics

Israel . 157 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Elevate your power electronics with the SPP11N80C3 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality power field effect transistors that offer reliable performance and efficiency. The SPP11N80C3 is designed for various applications, ensuring versatility and functionality for your projects. Experience the value and benefits of this N-channel transistor, from its high breakdown voltage to its low on-resistance. Trust in the innovation and expertise of Infineon Technologies to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance in various electronic circuit applications.

Minimum DS Breakdown Voltage: 800 V

Ensures high voltage capability, suitable for demanding applications.

Operating Mode: ENHANCEMENT MODE

Allows for easier control of the transistor's on/off state.

Maximum Pulsed Drain Current (IDM): 33 A

Handles high current spikes effectively, making it suitable for power applications.

Maximum Power Dissipation (Abs): 156 W

Can dissipate a significant amount of heat without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures high efficiency and reliability in operation.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments, increasing its versatility.

Maximum Drain-Source On Resistance: 0.45 ohm

Provides low on-resistance for efficient power transmission.

Technical Specifications

Power Field Effect Transistors (FET) SPP11N80C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

470 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

SPP11N80C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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