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SFH4231

Infineon Technologies

SFH4231 by Infineon Technologies

Infineon's SFH4231 Laser Diode operates at 920nm peak wavelength with 1A max forward current. Ideal for surface mount applications, it has a spectral bandwidth of 1m and can withstand temperatures from -40 to 85°C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Prism Electronics

USA . 1,145 parts In-Stock

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Digiode

USA . 325 parts In-Stock

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Vyrian

USA . 237 parts In-Stock

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Nova Conductors

Japan . 57 parts In-Stock

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Ashlea Components Ltd

UK . 6 parts In-Stock

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Ampacity Inc.

Singapore . 612 parts In-Stock

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$0.100

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Modulus Dynamics

Lithuania . 5,254 parts In-Stock

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$0.309

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$0.297

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$0.284

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AZTECH Wire

Italy . 597 parts In-Stock

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$9.461

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Component Stockers USA

USA . 764 parts In-Stock

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$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,187 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

USA . 3,366 parts In-Stock

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Bastille Electronics

Australia . 2,987 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Unleash the power of cutting-edge technology with the SFH4231 Laser Diode by Infineon Technologies. Known for their superior quality and reliability, Infineon leads the industry in optoelectronic components. The SFH4231 offers a peak wavelength of 920nm, making it ideal for a wide range of applications. With a maximum forward current of 1A and surface mounting feature, this laser diode delivers exceptional performance in any environment. Experience the value and benefits of Infineon's SFH4231 and take your projects to the next level.

Feature Benefit Bullets

Maximum Forward Current: 1 A

The high maximum forward current allows for efficient operation of the laser diode, ensuring reliable performance.

Peak Wavelength (nm): 920

The specific peak wavelength of 920 nm makes this laser diode suitable for various applications such as telecommunications or medical equipment.

Optoelectronic Type: LASER DIODE

Being a laser diode ensures that this product emits a highly coherent beam of light, making it ideal for precision applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for versatile use of the laser diode in different environments without compromising performance.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, this laser diode can also be used in cold environments without issue.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good solderability and reliability in the connection of the laser diode to the circuit.

Spectral Bandwidth: 1 m

The narrow spectral bandwidth of 1 m indicates high wavelength stability, which is crucial for applications requiring precise and consistent light output.

Mounting Feature: SURFACE MOUNT

The surface mounting feature provides ease of installation and allows for compact design integration in various electronic devices.

Maximum Forward Voltage: 3.4 V

The moderate maximum forward voltage requirement of 3.4 V ensures efficient power usage without excessive energy consumption.

Technical Specifications

Laser Diodes SFH4231 attributes and parameters. Explore more Laser Diodes devices from Infineon Technologies

Specs

Maximum Forward Current:

1 A

Maximum Forward Voltage:

3.4 V

JESD-609 Code:

e0

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Peak Wavelength (nm):

920

Spectral Bandwidth:

1 m

Sub-Category:

Laser Diodes

Terminal Finish:

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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