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SAL-XC866L-2FRA3VBE

Infineon Technologies

SAL-XC866L-2FRA3VBE by Infineon Technologies

Infineon's SAL-XC866L-2FRA3VBE microcontroller features 8-bit architecture, 12 MHz clock frequency, and 27 I/O lines. With ADC and PWM channels, it is ideal for applications requiring precise analog-to-digital conversion and pulse-width modulation control in compact designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 1,412 parts In-Stock

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Digiode

USA . 802 parts In-Stock

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802

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Semicontronic

India . 920 parts In-Stock

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$6.000

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$5.850

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$5.820

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920

$6.000

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AZTECH Wire

Italy . 620 parts In-Stock

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$10.801

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Ampacity Inc.

Singapore . 843 parts In-Stock

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$27.000

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843

$27.000

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Modulus Dynamics

Lithuania . 4,623 parts In-Stock

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$51.717

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$49.648

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$47.580

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4,623

$51.717

$49.648

$47.580

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Bastille Electronics

Australia . 3,619 parts In-Stock

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Argo Parts USA

USA . 2,892 parts In-Stock

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Continental Prestige Electronics

USA . 380 parts In-Stock

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Corphita

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Overview

Elevate your projects with the SAL-XC866L-2FRA3VBE microcontroller from Infineon Technologies, a leader in cutting-edge technology. This versatile device boasts a compact design and impressive features like ADC channels and PWM channels, making it perfect for a wide range of applications. With a maximum clock frequency of 12 MHz and a nominal supply voltage of 2.5 V, this microcontroller offers high performance and efficiency. Trust Infineon's reputation for quality and innovation to bring value and reliability to your next project. Experience the benefits of seamless integration and advanced functionality with the SAL-XC866L-2FRA3VBE microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller a convenient choice for manufacturing.

Maximum Supply Voltage: 2.7 V

The maximum supply voltage of 2.7 V provides flexibility in power input options while ensuring safe operation, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, contributing to a compact and streamlined design.

Bit Size: 8

With an 8-bit architecture, this microcontroller is suitable for applications that do not require high computational power but still need a reliable and cost-effective solution.

No. of Terminals: 38

The abundance of terminals allows for easy connectivity with external components and peripherals, enhancing the versatility of the microcontroller.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style not only contributes to space-saving on the PCB but also improves heat dissipation and overall product efficiency.

Minimum Supply Voltage: 2.3 V

The minimum supply voltage of 2.3 V ensures reliable operation even under low power conditions, making it suitable for battery-powered applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: DUAL

Dual terminal positions provide redundancy and increased durability, ensuring reliable connections and reducing the risk of signal interruptions.

Width: 4.4 mm

The slim width of 4.4 mm contributes to the overall compactness of the microcontroller, allowing for integration into space-constrained designs.

Maximum Clock Frequency: 12 MHz

The high maximum clock frequency of 12 MHz allows for swift data processing and efficient operation, making this microcontroller ideal for applications requiring high-speed performance.

Length: 9.7 mm

The compact length of 9.7 mm further enhances the space-saving design of the microcontroller, making it suitable for applications where size constraints are a consideration.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines processing power, input/output interfaces, and other features in a single integrated circuit, offering a comprehensive solution for embedded systems.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and fast switching speeds, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections and easy soldering during assembly, contributing to the overall robustness and reliability of the product.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V strikes a balance between power efficiency and performance, making this microcontroller suitable for a wide range of applications.

PWM Channels: YES

The availability of Pulse-Width Modulation (PWM) channels enables precise control of analog outputs, making this microcontroller suitable for applications such as motor control and power management.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting on the PCB, optimizing space utilization and enabling compact and efficient system designs.

Speed: 75 rpm

The speed of 75 rpm indicates the rotational speed capability of the microcontroller, making it suitable for applications that require precise timing and control of rotational mechanisms.

No. of I/O Lines: 27

With 27 Input/Output (I/O) lines, this microcontroller offers ample interfacing capabilities for connecting with external devices and peripherals, enhancing its versatility and functionality.

Technical Specifications

Microcontrollers SAL-XC866L-2FRA3VBE attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

9.7 mm

No. of I/O Lines:

27

No. of Terminals:

38

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Speed:

75 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SAL-XC866L-2FRA3VBE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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