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SAL-XC866L-2FRA5VBE

Infineon Technologies

SAL-XC866L-2FRA5VBE by Infineon Technologies

Infineon's SAL-XC866L-2FRA5VBE microcontroller features 8-bit size, 12 MHz clock frequency, and 27 I/O lines. Ideal for applications requiring a small outline package with dual terminal position and ADC channels. Operating at a speed of 75 rpm, it is suitable for various CMOS technology-based projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 774 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Vyrian

USA . 235 parts In-Stock

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Semicontronic

India . 895 parts In-Stock

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$2.000

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$1.950

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$1.940

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895

$2.000

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Ampacity Inc.

Singapore . 127 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 599 parts In-Stock

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$12.876

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599

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Modulus Dynamics

Lithuania . 1,018 parts In-Stock

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$44.329

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$42.556

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$40.783

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1,018

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$40.783

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Continental Prestige Electronics

USA . 5,013 parts In-Stock

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Bastille Electronics

Australia . 4,152 parts In-Stock

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Argo Parts USA

USA . 946 parts In-Stock

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Corphita

USA . 927 parts In-Stock

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Overview

Unlock endless possibilities with the SAL-XC866L-2FRA5VBE microcontroller by Infineon Technologies. Designed to deliver unparalleled performance and reliability, this microcontroller is perfect for a wide range of applications. From smart home devices to industrial automation systems, this product offers unmatched value and benefits to customers seeking high-quality solutions. Experience innovation like never before with the SAL-XC866L-2FRA5VBE and take your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs, reducing assembly time and costs.

Maximum Supply Voltage: 2.7 V

Low power consumption and efficient operation.

Package Shape: RECTANGULAR

Saves space and allows for compact designs.

Bit Size: 8

Suitable for small-scale applications and projects.

No. of Terminals: 38

Sufficient connectivity options for various peripherals.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Ensures a compact form factor and efficient heat dissipation.

Minimum Supply Voltage: 2.3 V

Wide operating voltage range for versatility.

ADC Channels: YES

Enables analog-to-digital conversion for sensor integration.

Terminal Position: DUAL

Allows for flexible PCB layout options.

Width: 4.4 mm

Slim profile for space-constrained designs.

Maximum Clock Frequency: 12 MHz

Provides high-speed processing capabilities.

Length: 9.7 mm

Compact size for integration in small devices.

Peripheral IC Type: MICROCONTROLLER

All-in-one solution for control and connectivity tasks.

Technology: CMOS

Low power consumption and reliability.

Terminal Form: GULL WING

Secure and reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Optimal voltage for stable performance.

PWM Channels: YES

Supports pulse-width modulation for precise control.

Terminal Pitch: 0.5 mm

Fine pitch for high-density PCB designs.

Speed: 75 rpm

Suitable for applications requiring moderate processing speed.

No. of I/O Lines: 27

Sufficient input and output options for project flexibility.

Technical Specifications

Microcontrollers SAL-XC866L-2FRA5VBE attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

9.7 mm

No. of I/O Lines:

27

No. of Terminals:

38

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Speed:

75 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SAL-XC866L-2FRA5VBE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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