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SAF-C167CR-LM

Infineon Technologies

SAF-C167CR-LM by Infineon Technologies

SAF-C167CR-LM by Infineon: 16-bit microcontroller with 24-bit address bus, 5V supply, and 40MHz clock freq. Ideal for industrial applications requiring DAC/ADC channels, PWM support, and MROM programmability. Package style is flatpack with quad terminals and GULL WING finish.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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Nova Conductors

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Huijzer Components

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LIBRA Elektronik GmbH

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Velocity Electronics

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Semicontronic

India . 1,645 parts In-Stock

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$7.800

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$7.760

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AZTECH Wire

Italy . 205 parts In-Stock

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Corohmni

South Africa . 213 parts In-Stock

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Ampacity Inc.

Singapore . 1,438 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 2,034 parts In-Stock

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Metaverse IC Inc.

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Continental Prestige Electronics

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Overview

Discover the power of the SAF-C167CR-LM microcontroller by Infineon Technologies, a game-changer in the world of embedded systems. Designed with precision and reliability, this product offers unmatched quality and performance. With a wide range of applications in various industries, this microcontroller delivers exceptional value and benefits to customers. Unlock endless possibilities with the SAF-C167CR-LM and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This makes the product lightweight and durable, perfect for portable applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, saving space and time.

Maximum Supply Voltage: 5.5 V

A higher supply voltage allows for greater flexibility in power input.

Address Bus Width: 24

A wider address bus allows for higher memory capacity and more efficient data handling.

Package Shape: SQUARE

A square package shape is typically more space-efficient and easier to mount.

Bit Size: 16

A 16-bit architecture enables faster processing and higher data throughput.

DAC Channels: YES

Digital-to-analog converter channels allow for precise analog signal generation.

Power Supplies (V): 5

Operating within a standard power supply range of 5V ensures compatibility with common power sources.

No. of Terminals: 144

A higher number of terminals offers more connectivity options and expansion capabilities.

Package Style (Meter): FLATPACK

Flatpack packaging is often more robust and offers better thermal performance.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage allows for efficient power management and usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

CPU Family: 80166

Being part of the 80166 CPU family ensures compatibility and support from established technology.

Minimum Operating Temperature: -40 °C

The product can operate in very low-temperature environments, making it versatile in various applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and conductivity for stable connections.

ADC Channels: YES

Analog-to-digital converter channels enable accurate conversion of analog signals to digital data.

Terminal Position: QUAD

Quad terminal positioning allows for easier PCB layout and more efficient signal routing.

Maximum Seated Height: 2.75 mm

A low seated height is beneficial for slim and compact device designs.

Width: 28 mm

With a moderate width, the product can fit into various form factors and enclosures.

External Data Bus Width: 16

A 16-bit external data bus enables fast data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 40 MHz

Operating at a high clock frequency allows for rapid data processing and responsiveness.

Length: 28 mm

With a moderate length, the product can be integrated into different device configurations.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, ensuring reliability and performance under demanding conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product combines multiple functions in a single integrated circuit for efficient control and processing.

RAM Bytes: 2048

Having 2048 bytes of RAM provides sufficient memory for data storage and processing.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Maximum Supply Current: 120 mA

With a maximum supply current of 120 mA, the product ensures efficient power usage and minimized heat dissipation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and components.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals for various applications.

ROM Programmability: MROM

Mask-programmable ROM offers secure and permanent storage of essential firmware and data.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65mm, the product supports high-density PCB designs and miniaturization.

Speed: 25 rpm

Operating at a speed of 25 rpm, the product can process data and execute commands efficiently.

No. of I/O Lines: 111

Having 111 I/O lines provides ample connectivity for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SAF-C167CR-LM attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

80166

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e0

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Programmability:

MROM

Maximum Seated Height:

2.75 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SAF-C167CR-LM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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