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SAF-C505CA-4EMCATR

Infineon Technologies

SAF-C505CA-4EMCATR by Infineon Technologies

Infineon's SAF-C505CA-4EMCATR is an 8-bit microcontroller with 16-bit address bus, 32768 ROM words, and 1024 RAM bytes. It operates at a max clock frequency of 20 MHz and features 8 ADC channels for analog to digital conversion. Ideal for industrial applications requiring CAN and USART connectivity with PWM support.

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Vyrian

USA . 527 parts In-Stock

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Digiode

USA . 394 parts In-Stock

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Nova Conductors

Japan . 66 parts In-Stock

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AZTECH Wire

Italy . 527 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,388 parts In-Stock

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Semicontronic

India . 642 parts In-Stock

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$19.500

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Ampacity Inc.

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Modulus Dynamics

Lithuania . 570 parts In-Stock

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$37.606

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$36.102

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$34.598

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Continental Prestige Electronics

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Bastille Electronics

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Argo Parts USA

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Overview

Unlock the endless possibilities with the SAF-C505CA-4EMCATR microcontroller by Infineon Technologies. Designed with precision and quality in mind, this versatile device offers a wide range of applications in various industries. With advanced features like ADC channels, PWM channels, and connectivity options such as CAN and USART, this microcontroller provides unmatched value and benefits to customers. Whether you're looking to enhance your automation system or develop innovative IoT solutions, the SAF-C505CA-4EMCATR is the perfect choice for your next project. Experience superior performance and reliability with this cutting-edge microcontroller.

Feature Benefit Bullets

Dielectric Material: CERAMIC

Ceramic is a reliable and durable dielectric material, providing good electrical insulation and stability over time.

Multi-layer: Yes

Multi-layer design allows for higher capacitance in a smaller package, making it ideal for space-constrained applications.

Packing Method: TR, EMBOSSED PLASTIC, 7 INCH

The TR packaging with embossed plastic ensures protection during transportation and handling, maintaining the capacitor's integrity.

No. of Terminals: 2

Having two terminals simplifies the connection process, making it easier to integrate into circuits.

Package Style (Meter): SMT

Surface-mount technology (SMT) package style allows for easy and efficient integration onto circuit boards, saving assembly time.

Terminal Shape: WRAPAROUND

Wraparound terminals provide strong mechanical connection and reduce the risk of solder joint failure.

Negative Tolerance: 5 %

Having a tight negative tolerance ensures that the capacitor will not exceed its specified capacitance value, leading to better accuracy in the circuit.

Temperature Characteristics Code: X7R

X7R code indicates a stable temperature coefficient, making this capacitor suitable for a wide range of operating temperatures.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this capacitor can withstand a range of environmental conditions, ensuring reliability and longevity.

Capacitor Type: CERAMIC CAPACITOR

Being a ceramic capacitor, it offers low dissipation factor, high insulation resistance, and stability, making it a versatile choice for various applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this capacitor to function reliably in cold environments without compromising performance.

Temperature Coef (ppm/°C): 15%

The low temperature coefficient ensures that the capacitance value remains stable over a wide temperature range, providing consistent performance.

Terminal Finish: MATTE TIN OVER NICKEL

Matte tin over nickel terminal finish offers good solderability and corrosion resistance, enhancing the capacitor's reliability and longevity.

Height: 0.78 mm

The compact height allows for space-efficient placement on the circuit board, especially useful in devices where size is a constraint.

Width: 1.6 mm

Narrow width facilitates close placement of components on the board, optimizing space utilization and aiding in miniaturization of electronic devices.

Mounting Feature: SURFACE MOUNT

Surface-mounting feature simplifies the assembly process, reduces assembly costs, and enables automated soldering, enhancing overall production efficiency.

Length: 3.2 mm

The moderate length of the capacitor provides a balanced form factor, suitable for a variety of circuit board layouts and designs.

Positive Tolerance: 5 %

A positive tolerance of 5% ensures that the capacitor's actual capacitance value will not fall below the specified value, maintaining accuracy in circuit performance.

Capacitance: 0.033 uF

With a capacitance of 0.033 uF, this capacitor is suitable for filtering, decoupling, and energy storage applications in various electronic circuits.

Rated DC Voltage (URdc): 250 V

Having a rated DC voltage of 250 V enables this capacitor to handle higher voltage levels, making it suitable for more demanding circuit applications.

Technical Specifications

Microcontrollers SAF-C505CA-4EMCATR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

2.45 mm

Speed:

20 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, USART

Peripherals:

POR, TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

SAF-C505CA-4EMCATR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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