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SAF-C167CR-LM-GA-T6

Infineon Technologies

SAF-C167CR-LM-GA-T6 by Infineon Technologies

SAF-C167CR-LM-GA-T6 by Infineon: 16-bit microcontroller with 24-bit address bus, 16-bit external data bus, and max clock freq of 25 MHz. Ideal for industrial applications requiring PWM control, ADC channels, and 111 I/O lines in a compact flatpack package. Operating temp range -40 to 85 °C.

Median Price

$18.365

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Adafruit Industries

USA . 26 parts In-Stock

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EXC GmbH

Germany . 13 parts In-Stock

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$9.810

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$26.920

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$20.190

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$17.500

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LIBRA Elektronik GmbH

Germany . 639 parts In-Stock

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Digiode

USA . 264 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

France . 23 parts In-Stock

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Bristol Electronics

USA . 23 parts In-Stock

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Dan-Mar Components

USA . 23 parts In-Stock

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Vyrian

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Tectiva GmbH

Germany . 4 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 866 parts In-Stock

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$14.265

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Aztec Data Supply Inc.

USA . 1,212 parts In-Stock

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$19.928

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Semicontronic

India . 26 parts In-Stock

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$23.000

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$22.425

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$22.310

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Modulus Dynamics

Lithuania . 3,575 parts In-Stock

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$63.489

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$60.949

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$58.410

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Corohmni

South Africa . 1,043 parts In-Stock

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$86.556

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Continental Prestige Electronics

USA . 6,125 parts In-Stock

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Argo Parts USA

USA . 3,247 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Bastille Electronics

Australia . 853 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the SAF-C167CR-LM-GA-T6 microcontroller by Infineon Technologies. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability in various applications. From industrial automation to automotive systems, this microcontroller delivers seamless operation and efficiency. Experience the ultimate value and benefits with Infineon's top-notch quality and advanced features, setting new standards in the industry. Upgrade your projects with the SAF-C167CR-LM-GA-T6 and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and resources during manufacturing.

Maximum Supply Voltage: 5.5 V

Allows for a higher voltage input, giving flexibility in power supply options.

Address Bus Width: 24

Offers a wide address bus width, allowing for a larger memory address space and more versatile data handling.

Package Shape: SQUARE

Optimal shape for efficient space utilization on the PCB, especially in compact designs.

Bit Size: 16

Suitable for processing moderate amounts of data efficiently, making it a balanced choice for many applications.

No. of Terminals: 144

Provides a sufficient number of terminals for connecting various external devices and components, enhancing the microcontroller's functionality.

Package Style (Meter): FLATPACK

Offers a flat package style for easy integration into the PCB layout and assembly process.

Minimum Supply Voltage: 4.5 V

Allows for operation at lower voltages, conserving power and providing energy-efficient performance.

Maximum Operating Temperature: 85 °C

Can operate under high-temperature conditions, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, making it suitable for a wide range of operating conditions.

ADC Channels: YES

Includes ADC channels for analog input processing, broadening the range of supported sensor and input devices.

Terminal Position: QUAD

Quad terminal layout allows for efficient and organized connection of external components, facilitating PCB design and assembly.

Maximum Seated Height: 2.75 mm

Low profile design helps in compact PCB assembly and integration, especially in applications with size constraints.

Width: 28 mm

Compact width dimension for space-efficient PCB design and integration in various electronic devices.

External Data Bus Width: 16

Supports a 16-bit external data bus width, enabling faster data transfer and processing capabilities.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast and efficient processing of instructions and data, suitable for real-time applications.

Length: 28 mm

Compact length dimension for space-efficient PCB design and integration in various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller functionality consolidates various features and capabilities in a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly on the PCB, ensuring a reliable electrical connection.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with various power sources and electronic systems.

PWM Channels: YES

Includes PWM channels for precise control of analog signals and devices, enhancing the microcontroller's versatility.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for densely packed terminals, optimizing PCB space utilization and enabling high I/O density.

Speed: 25 rpm

Offers a maximum speed of 25 rpm for efficient data processing and system operation, suitable for a variety of applications.

No. of I/O Lines: 111

Provides a substantial number of I/O lines for interfacing with external devices and components, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers SAF-C167CR-LM-GA-T6 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.75 mm

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

SAF-C167CR-LM-GA-T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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