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IRL530NLPBF

Infineon Technologies

IRL530NLPBF by Infineon Technologies

IRL530NLPBF by Infineon is a N-CHANNEL FET with 100V DS breakdown voltage and 60A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and operates in ENHANCEMENT MODE. With a max power dissipation of 79W, it has a 0.12 ohm drain-source resistance and can handle up to 17A drain current.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 1,023 parts In-Stock

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1,023

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 249 parts In-Stock

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249

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Modulus Dynamics

Lithuania . 23,667 parts In-Stock

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$0.752

100+ parts

$0.722

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$0.692

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23,667

$0.752

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$0.692

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AZTECH Wire

Italy . 436 parts In-Stock

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$6.029

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436

$6.029

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Ampacity Inc.

Singapore . 1,235 parts In-Stock

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$19.050

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$19.050

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A-Z Elektronik GmbH

Germany . 6,219 parts In-Stock

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6,219

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Alle Elektronik GmbH

Germany . 4,146 parts In-Stock

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4,146

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Corphita

USA . 266 parts In-Stock

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266

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Overview

Enhance your power switching applications with the IRL530NLPBF by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers reliability and efficiency. Its single configuration with a built-in diode ensures seamless operation while its high voltage breakdown capacity of 100V guarantees robust performance. Ideal for a variety of switching tasks, this transistor boasts a maximum power dissipation of 79W and a maximum drain current of 17A, providing unmatched value and benefits to customers looking for quality components. Experience superior functionality and durability with the IRL530NLPBF - the perfect choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FET lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance characteristics compared to P-Channel FETs, making this product a good choice for efficient operation.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage, increasing reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast switching speeds and low power dissipation, ideal for power management.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltage levels without breakdown, ensuring reliable performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and space-saving design, making it suitable for compact electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering, ensuring stable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and easy control, allowing for efficient operation in various circuits.

Maximum Pulsed Drain Current (IDM): 60 A

With a high pulsed drain current rating, this FET can handle short-duration high current spikes without damage, suitable for demanding applications.

Avalanche Energy Rating (EAS): 150 mJ

The high avalanche energy rating indicates the ability of this FET to withstand high-energy transients, ensuring robust performance in rugged conditions.

Maximum Drain Current (Abs) (ID): 17 A

The high maximum drain current rating allows this FET to handle high continuous current levels, making it suitable for power-hungry applications.

No. of Terminals: 3

Having 3 terminals allows for easy connectivity and control in a circuit, simplifying design and installation.

Maximum Power Dissipation (Abs): 79 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring reliable operation.

Package Style (Meter): IN-LINE

The in-line package style offers easy integration into existing circuit layouts, making it convenient for design and assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and fast switching speeds, contributing to the overall performance of this FET.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, suitable for harsh environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance and reliability, making this product a good choice for critical applications.

Terminal Finish: Matte Tin (Sn) - with Nickel (Ni) barrier

The matte tin finish with nickel barrier provides corrosion resistance and ensures long-term reliability in various operating conditions.

Maximum Drain Current (ID): 17 A

The high maximum drain current rating allows this FET to handle substantial current levels, making it suitable for power-intensive tasks.

Maximum Drain-Source On Resistance: 0.12 ohm

With a low drain-source on resistance, this FET can achieve efficient power conduction and minimal power loss, enhancing overall performance.

Terminal Position: SINGLE

Having a single terminal position simplifies circuit design and installation, ensuring ease of use and connectivity in various applications.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation, ensuring the FET remains cool during operation for optimal performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time at peak temperature, this FET can be easily integrated into surface mount assembly processes, saving time and effort.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and assembly processes, ensuring long-term durability in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) IRL530NLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

150 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - with Nickel (Ni) barrier

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRL530NLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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