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IRFHM9391TRPBF

Infineon Technologies

IRFHM9391TRPBF by Infineon Technologies

Infineon's IRFHM9391TRPBF is a P-CHANNEL FET with 30V DS Breakdown Voltage, 90A IDM, and 0.0225 ohm RDS. Ideal for SWITCHING applications due to its 75mJ EAS rating and 33W power dissipation in a SMALL OUTLINE package.

Median Price

$0.278

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

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$0.278

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Chip Stock

USA . 40,609 parts In-Stock

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Digiode

USA . 966 parts In-Stock

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966

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Vyrian

USA . 635 parts In-Stock

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635

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Distributors (Availability)

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.272

100+ parts

-

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$0.262

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500

$0.272

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$0.262

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Continental Prestige Electronics

USA . 4,130 parts In-Stock

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$0.278

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$0.272

4,130

$0.278

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$0.272

Argo Parts USA

USA . 3,140 parts In-Stock

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$0.278

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$0.270

3,140

$0.278

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$0.270

Modulus Dynamics

Lithuania . 11,365 parts In-Stock

1+ parts

$0.353

100+ parts

$0.339

1k+ parts

$0.325

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11,365

$0.353

$0.339

$0.325

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Advanced Electronics

New Zealand . 19 parts In-Stock

1+ parts

$1.618

100+ parts

$1.472

1k+ parts

$1.327

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19

$1.618

$1.472

$1.327

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Corohmni

South Africa . 960 parts In-Stock

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$1.642

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960

$1.642

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Aztec Data Supply Inc.

USA . 109 parts In-Stock

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$1.890

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109

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AZTECH Wire

Italy . 882 parts In-Stock

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$16.169

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Ampacity Inc.

Singapore . 599 parts In-Stock

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$27.050

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599

$27.050

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Semicontronic

India . 1,039 parts In-Stock

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$35.050

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$34.174

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$33.998

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1,039

$35.050

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RC Electronics

USA . 75,128 parts In-Stock

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Robosynatics

Brazil . 15,301 parts In-Stock

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Lucentia Tech

USA . 15,301 parts In-Stock

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$1.877

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$1.838

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$1.838

15,301

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$1.877

$1.838

$1.838

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Microchip USA

USA . 487 parts In-Stock

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487

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Corphita

USA . 256 parts In-Stock

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Overview

Unlock the power of your electronics with the IRFHM9391TRPBF by Infineon Technologies. Crafted with precision and excellence, this P-CHANNEL Power Field Effect Transistor offers unparalleled performance for switching applications. With a robust design and high-quality materials, this transistor provides reliability and efficiency like no other. Whether you're looking to enhance your circuitry or improve overall functionality, this product delivers outstanding value and benefits for all your electronic needs. Trust in the expertise of Infineon Technologies and experience the difference today!

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and reliability, making it a good choice for various applications.

Polarity or Channel Type

P-CHANNEL - P-channel FETs are known for their high efficiency and low RDS(on), making this product ideal for power management applications.

Configuration

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and improves efficiency, making this FET a convenient choice for switching applications.

Transistor Application

SWITCHING - Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation.

Surface Mount

YES - This feature allows for easy and efficient PCB assembly, making this FET suitable for compact designs.

Minimum DS Breakdown Voltage

30 V - With a high breakdown voltage, this FET can handle a wide range of voltages, making it versatile for various applications.

Package Shape

SQUARE - The square shape of the package contributes to efficient heat dissipation, enhancing the overall performance and reliability of the FET.

Terminal Form

NO LEAD - The absence of leads reduces resistance and improves thermal performance, making this FET a high-performing choice.

Operating Mode

ENHANCEMENT MODE - This mode ensures fast and reliable operation, making the FET suitable for high-speed applications.

Maximum Pulsed Drain Current (IDM)

90 A - With a high pulsed drain current rating, this FET can handle short-term peak loads, ensuring reliable performance in demanding conditions.

Avalanche Energy Rating (EAS)

75 mJ - The high avalanche energy rating provides protection against voltage spikes, making this FET suitable for rugged environments.

Maximum Drain Current (Abs) (ID)

38 A - With a high drain current rating, this FET can handle high power loads, making it ideal for power applications.

No. of Terminals

8 - The multiple terminals allow for versatile connections, making this FET suitable for complex circuit designs.

Maximum Power Dissipation (Abs)

33 W - With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring long-term reliability.

Package Style (Meter)

SMALL OUTLINE - The small outline package saves space on the PCB, making this FET suitable for compact designs.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - This technology offers high efficiency and reliability, making the FET a durable choice for various applications.

Maximum Operating Temperature

150 °C - With a high operating temperature range, this FET can operate in harsh environments without sacrificing performance.

Transistor Element Material

SILICON - The use of silicon as the element material ensures high performance and reliability, making this FET a dependable choice for various applications.

Maximum Drain Current (ID)

11 A - With a high drain current rating, this FET can handle moderate power loads, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance

0.0225 ohm - The low RDS(on) value reduces power loss and improves efficiency, making this FET ideal for power-critical applications.

Terminal Position

DUAL - The dual terminal position allows for versatile circuit configurations, making this FET suitable for diverse applications.

Case Connection

DRAIN - The drain connection ensures efficient heat dissipation, improving overall performance and reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) IRFHM9391TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

75 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0225 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

90 A

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFHM9391TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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