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IRFB4310PBF

Infineon Technologies

IRFB4310PBF by Infineon Technologies

IRFB4310PBF by Infineon is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It has a max IDM of 550A and EAS of 980mJ, suitable for SWITCHING applications. With 0.007 ohm RDS(on) and 175°C Max Temp, it offers high power dissipation up to 300W in ENHANCEMENT MODE operation.

Median Price

$2.319

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 815 parts In-Stock

1+ parts

$1.380

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815

$1.380

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Arrow

USA . 3,500 parts In-Stock

1+ parts

$1.752

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$1.100

1k+ parts

$1.015

10k+ parts

$1.005

3,500

$1.752

$1.100

$1.015

$1.005

Adafruit Industries

USA . 10 parts In-Stock

1+ parts

$2.492

100+ parts

$2.367

1k+ parts

$2.367

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10

$2.492

$2.367

$2.367

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RS Americas

USA . 235 parts In-Stock

1+ parts

$3.380

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$2.880

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235

$3.380

$2.880

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Mouser Electronics

USA . 1,360 parts In-Stock

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$4.070

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$1.990

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$1.540

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$1.450

1,360

$4.070

$1.990

$1.540

$1.450

Element14

Singapore . 476 parts In-Stock

1+ parts

$4.300

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$2.930

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$2.220

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$2.000

476

$4.300

$2.930

$2.220

$2.000

DigiKey

USA . 27,589 parts In-Stock

1+ parts

$5.400

100+ parts

$2.514

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$1.924

10k+ parts

$1.673

27,589

$5.400

$2.514

$1.924

$1.673

Verical

USA . 2,598 parts In-Stock

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$1.393

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$1.288

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$1.262

2,598

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$1.262

Future Electronics

Canada . 2,000 parts In-Stock

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$1.070

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$1.010

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$0.960

2,000

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$1.070

$1.010

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Rochester

USA . 1,975 parts In-Stock

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$1.560

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$1.290

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$1.150

1,975

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RS (Exports)

UK . 289 parts In-Stock

1+ parts

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$2.319

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$2.178

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289

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$2.319

$2.178

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Distributors (In-Stock)

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Digiode

USA . 102 parts In-Stock

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$1.216

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102

$1.216

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Nova Conductors

Japan . 50 parts In-Stock

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$2.073

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50

$2.073

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TME

Poland . 153 parts In-Stock

1+ parts

$3.510

100+ parts

$1.290

1k+ parts

$1.220

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153

$3.510

$1.290

$1.220

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Voyager Components

USA . 28 parts In-Stock

1+ parts

$4.158

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28

$4.158

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Rutronik

Germany . 18,900 parts In-Stock

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$1.400

10k+ parts

$1.082

18,900

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$1.400

$1.082

Cyclops Electronics Ltd

UK . 12,000 parts In-Stock

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Astute Electronics Inc

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IBS Electronics

USA . 9,235 parts In-Stock

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$2.342

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$1.459

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$2.342

$1.459

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Sternenhof Electronics

Switzerland . 5,981 parts In-Stock

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Sensible Micro Corp

USA . 3,608 parts In-Stock

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Vyrian

USA . 1,041 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

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Holdelec - ElecDif-Pro

France . 500 parts In-Stock

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500

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Bristol Electronics

USA . 350 parts In-Stock

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350

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LIBRA Elektronik GmbH

Germany . 94 parts In-Stock

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Micros

Poland . 50 parts In-Stock

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$2.028

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$1.998

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50

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$2.028

$1.998

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North Shore Components

USA . 46 parts In-Stock

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46

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Semi Source

USA . 24 parts In-Stock

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Contempo Components LLC

USA . 22 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 750 parts In-Stock

1+ parts

$0.850

100+ parts

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750

$0.850

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Semicontronic

India . 974 parts In-Stock

1+ parts

$0.980

100+ parts

$0.956

1k+ parts

$0.951

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974

$0.980

$0.956

$0.951

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Corphita

USA . 629 parts In-Stock

1+ parts

$1.152

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629

$1.152

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Aztec Data Supply Inc.

USA . 2,240 parts In-Stock

1+ parts

$1.705

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2,240

$1.705

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Argo Parts USA

USA . 3,056 parts In-Stock

1+ parts

$1.935

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3,056

$1.935

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.073

100+ parts

$2.032

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100

$2.073

$2.032

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Modulus Dynamics

Lithuania . 2,904 parts In-Stock

1+ parts

$2.419

100+ parts

$2.322

1k+ parts

$2.225

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2,904

$2.419

$2.322

$2.225

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Corohmni

South Africa . 945 parts In-Stock

1+ parts

$2.419

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945

$2.419

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Continental Prestige Electronics

USA . 479 parts In-Stock

1+ parts

$2.450

100+ parts

$1.470

1k+ parts

$1.100

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479

$2.450

$1.470

$1.100

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$2.492

100+ parts

$2.367

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$2.367

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10

$2.492

$2.367

$2.367

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Microchip USA

USA . 2,980 parts In-Stock

1+ parts

$23.335

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2,980

$23.335

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Metaverse IC Inc.

Canada . 100,000 parts In-Stock

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Glotronic Ltd.

UK . 67,500 parts In-Stock

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67,500

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RC Electronics

USA . 30,000 parts In-Stock

1+ parts

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$2.300

1k+ parts

$2.100

10k+ parts

$2.040

30,000

-

$2.300

$2.100

$2.040

GreenTree Electronics

Israel . 20,000 parts In-Stock

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Perfect Parts

USA . 18,256 parts In-Stock

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Lixinc

USA . 11,756 parts In-Stock

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Kepictronics

USA . 8,800 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,052 parts In-Stock

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6,052

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iodParts Technologies Inc.

India . 2,820 parts In-Stock

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2,820

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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2,400

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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1,600

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Authorized Procurement Solutions

USA . 1,400 parts In-Stock

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1,400

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Speed Components Ltd (Excess)

Israel . 122 parts In-Stock

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122

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Overview

Experience the next level of power efficiency and performance with the IRFB4310PBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for switching applications, this N-channel transistor offers enhanced mode operation and a built-in diode for seamless functionality. With a high maximum drain current and low on-resistance, this transistor provides exceptional value and benefits to customers looking for superior power management solutions. Elevate your electronic designs with the IRFB4310PBF and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current carrying capacity, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers protection against reverse voltage spikes, enhancing overall system efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power consumption.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle high voltage loads without breakdown, ensuring reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and space-saving installation in various electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for simple control of the FET, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 550 A

The high pulsed drain current rating allows for handling of sudden current spikes, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 980 mJ

The high avalanche energy rating ensures robustness against voltage spikes and transient events, enhancing the overall reliability of the FET.

Maximum Drain Current (Abs) (ID): 130 A

The high drain current rating allows for handling of high load currents, making it suitable for power-efficient applications.

No. of Terminals: 3

The 3-terminal configuration simplifies the connection setup and allows for easy integration into existing circuit designs.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation rating allows the FET to handle high power levels without overheating, ensuring reliable performance.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and efficient heat dissipation, enhancing overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides high switching speeds and low ON resistance, making it suitable for high-performance applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate efficiently in a wide range of temperature environments.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance and reliability in various applications.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin over nickel terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Drain Current (ID): 75 A

The high drain current rating allows for handling of heavy load currents, making it ideal for power applications.

Maximum Drain-Source On Resistance: 0.007 ohm

The low drain-source on resistance minimizes power loss and improves efficiency in power management applications.

Terminal Position: SINGLE

The single terminal position simplifies the connection setup and allows for easy integration into circuit designs.

Case Connection: DRAIN

The drain case connection allows for easy heat dissipation and efficient operation of the FET, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) IRFB4310PBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

980 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

130 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

550 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFB4310PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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