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IRF8313TRPBF

Infineon Technologies

IRF8313TRPBF by Infineon Technologies

IRF8313TRPBF by Infineon is a N-CHANNEL FET for SWITCHING applications. It has 2 ELEMENTS with BUILT-IN DIODE, offering a Max Pulsed Drain Current of 81A and Min DS Breakdown Voltage of 30V. With a Max Power Dissipation of 2W and Operating Temperature up to 175°C, it's ideal for high-power electronic systems.

Median Price

$0.378

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$0.477

100+ parts

$0.439

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$0.411

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450

$0.477

$0.439

$0.411

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Mouser Electronics

USA . 3,982 parts In-Stock

1+ parts

$0.830

100+ parts

$0.498

1k+ parts

$0.354

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$0.276

3,982

$0.830

$0.498

$0.354

$0.276

Verical

USA . 21,024 parts In-Stock

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$0.385

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$0.343

21,024

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$0.343

Arrow

USA . 4,000 parts In-Stock

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$0.269

4,000

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$0.269

Chip1Stop

Japan . 4,000 parts In-Stock

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$0.304

4,000

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$0.304

Rochester

USA . 805 parts In-Stock

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$0.371

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$0.308

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$0.274

805

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$0.371

$0.308

$0.274

Distributors (In-Stock)

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Digiode

USA . 200 parts In-Stock

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$0.289

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200

$0.289

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Nova Conductors

Japan . 64 parts In-Stock

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$0.398

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64

$0.398

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Maritex

Poland . 3,800 parts In-Stock

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$0.505

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Chip Stock

USA . 226,002 parts In-Stock

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Schukat

Germany . 17,950 parts In-Stock

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$0.373

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$0.310

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$0.299

17,950

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$0.373

$0.310

$0.299

Vyrian

USA . 9,730 parts In-Stock

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Component Sense

UK . 5,069 parts In-Stock

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5,069

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ComSIT Distribution GmbH

Germany . 3,120 parts In-Stock

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Bristol Electronics

USA . 95 parts In-Stock

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Astute Electronics Inc

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Sensible Micro Corp

USA . 42 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 9,504 parts In-Stock

1+ parts

$0.229

100+ parts

$0.223

1k+ parts

$0.222

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9,504

$0.229

$0.223

$0.222

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Ampacity Inc.

Singapore . 9,392 parts In-Stock

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$0.229

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9,392

$0.229

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Corphita

USA . 79 parts In-Stock

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$0.274

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79

$0.274

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Netroflash

USA . 2,000 parts In-Stock

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$0.398

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$0.390

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2,000

$0.398

$0.390

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Argo Parts USA

USA . 5 parts In-Stock

1+ parts

$0.398

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$0.386

5

$0.398

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-

$0.386

Modulus Dynamics

Lithuania . 9,328 parts In-Stock

1+ parts

$0.438

100+ parts

$0.420

1k+ parts

$0.403

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9,328

$0.438

$0.420

$0.403

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Corohmni

South Africa . 48 parts In-Stock

1+ parts

$0.438

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48

$0.438

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.477

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$0.439

1k+ parts

$0.411

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450

$0.477

$0.439

$0.411

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Continental Prestige Electronics

USA . 14,415 parts In-Stock

1+ parts

$0.854

100+ parts

$0.505

1k+ parts

$0.319

10k+ parts

$0.253

14,415

$0.854

$0.505

$0.319

$0.253

Aztec Data Supply Inc.

USA . 216 parts In-Stock

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$1.138

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216

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Perfect Parts

USA . 177,818 parts In-Stock

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RC Electronics

USA . 57,842 parts In-Stock

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$0.450

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Glotronic Ltd.

UK . 19,200 parts In-Stock

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Assy Fe

Spain . 11,100 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 8,000 parts In-Stock

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iodParts Technologies Inc.

India . 6,615 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Eastek

USA . 4,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,760 parts In-Stock

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2,760

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Alle Elektronik GmbH

Germany . 1,840 parts In-Stock

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1,840

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Kepictronics

USA . 940 parts In-Stock

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Lixinc

USA . 935 parts In-Stock

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935

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Overview

Discover the IRF8313TRPBF by Infineon Technologies, a high-quality Power Field Effect Transistor perfect for switching applications. With Infineon's reputation for excellence and innovation, this N-CHANNEL transistor offers exceptional performance and reliability. Its compact design, separate elements with built-in diode, and low on-resistance make it ideal for a wide range of applications. Experience the value and benefits of enhanced power efficiency and durability with the IRF8313TRPBF. Choose quality, choose Infineon!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-state resistance and higher switching speeds, making them suitable for high-performance applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having 2 separate elements with built-in diode allows for more efficient switching and control of current flow, enhancing overall performance.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in turning on and off circuits efficiently.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage loads, providing versatility in various electronic designs.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into circuit boards and provides efficient use of space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and have lower ON-state resistance, improving efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 81 A

High maximum pulsed drain current allows for handling of sudden spikes in current, making it suitable for applications requiring high power.

Avalanche Energy Rating (EAS): 46 mJ

High avalanche energy rating ensures the FET can withstand short-term overloads without damage, increasing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 9.7 A

With a maximum drain current of 9.7A, this FET can handle medium to high-power applications with ease.

Maximum Power Dissipation (Abs): 2 W

Low power dissipation allows for efficient operation and longer lifespan of the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides better performance in terms of speed, power, and reliability.

Maximum Operating Temperature: 175 °C

High maximum operating temperature makes this FET suitable for applications where heat dissipation is a concern.

Transistor Element Material: SILICON

Silicon material used in the transistor elements ensures stability, low leakage, and good performance over a wide temperature range.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in electronic circuits.

Maximum Drain-Source On Resistance: 0.0155 ohm

Low drain-source ON resistance ensures minimal power loss and improved efficiency in circuit operation.

Terminal Position: DUAL

Dual terminal position allows for easy integration into circuit boards and gives flexibility in connection options.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and connection reliability during the manufacturing process.

Technical Specifications

Power Field Effect Transistors (FET) IRF8313TRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

46 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

9.7 A

Maximum Drain Current (ID):

9.7 A

Maximum Drain-Source On Resistance:

.0155 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

81 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF8313TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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