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IPZ65R065C7XKSA1

Infineon Technologies

IPZ65R065C7XKSA1 by Infineon Technologies

IPZ65R065C7XKSA1 by Infineon is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. It features 145A max pulsed drain current and 0.065 ohm max drain-source resistance. This MOSFET operates in enhancement mode, with a temperature range of -55 to 150 °C.

Median Price

$7.605

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 45 parts In-Stock

1+ parts

$4.016

100+ parts

-

1k+ parts

$0.919

10k+ parts

-

45

$4.016

-

$0.919

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Rochester

USA . 6,936 parts In-Stock

1+ parts

$4.030

100+ parts

$3.950

1k+ parts

$3.870

10k+ parts

-

6,936

$4.030

$3.950

$3.870

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Farnell

UK . 126 parts In-Stock

1+ parts

$6.610

100+ parts

$3.010

1k+ parts

-

10k+ parts

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126

$6.610

$3.010

-

-

Chip1Stop

Japan . 235 parts In-Stock

1+ parts

$8.600

100+ parts

-

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235

$8.600

-

-

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Newark

USA . 126 parts In-Stock

1+ parts

$8.880

100+ parts

$4.800

1k+ parts

$4.400

10k+ parts

-

126

$8.880

$4.800

$4.400

-

DigiKey

USA . 136 parts In-Stock

1+ parts

$9.230

100+ parts

$5.425

1k+ parts

$4.142

10k+ parts

-

136

$9.230

$5.425

$4.142

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Mouser Electronics

USA . 1,196 parts In-Stock

1+ parts

$9.680

100+ parts

$5.690

1k+ parts

$5.070

10k+ parts

$4.740

1,196

$9.680

$5.690

$5.070

$4.740

Element14

Singapore . 126 parts In-Stock

1+ parts

$11.230

100+ parts

$5.900

1k+ parts

$5.760

10k+ parts

-

126

$11.230

$5.900

$5.760

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Avnet

USA . 320 parts In-Stock

1+ parts

-

100+ parts

$4.174

1k+ parts

$3.940

10k+ parts

-

320

-

$4.174

$3.940

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Verical

USA . 45 parts In-Stock

1+ parts

-

100+ parts

$0.919

1k+ parts

-

10k+ parts

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45

-

$0.919

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 635 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

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635

$4.294

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-

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Vyrian

USA . 1,914 parts In-Stock

1+ parts

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100+ parts

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1,914

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 237 parts In-Stock

1+ parts

$2.570

100+ parts

-

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237

$2.570

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-

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Corphita

USA . 697 parts In-Stock

1+ parts

$4.068

100+ parts

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697

$4.068

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Modulus Dynamics

Lithuania . 19,685 parts In-Stock

1+ parts

$8.244

100+ parts

$7.914

1k+ parts

$7.584

10k+ parts

-

19,685

$8.244

$7.914

$7.584

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Microchip USA

USA . 9,636 parts In-Stock

1+ parts

$33.572

100+ parts

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9,636

$33.572

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A-Z Elektronik GmbH

Germany . 1,440 parts In-Stock

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1,440

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Perfect Parts

USA . 1,075 parts In-Stock

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1,075

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your power management solutions with the IPZ65R065C7XKSA1 from industry leader Infineon Technologies. This high-quality Power FET offers unparalleled performance in switching applications, boasting a maximum DS breakdown voltage of 650V and a maximum drain current of 33A. With its single configuration and built-in diode, this transistor provides enhanced efficiency and reliability. Whether you're looking to optimize energy consumption or improve system functionality, the IPZ65R065C7XKSA1 delivers superior value and benefits that cater to your specific needs. Experience the difference with this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have better conductivity and efficiency compared to P-CHANNEL transistors, making this product a good choice for high-performance applications.

Minimum DS Breakdown Voltage: 650 V

With a high minimum breakdown voltage, this transistor can handle high voltage applications effectively and safely.

Maximum Pulsed Drain Current (IDM): 145 A

The high pulsed drain current rating allows this transistor to handle high current spikes without damage, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 171 W

The high power dissipation rating ensures that this transistor can handle high power loads without overheating, making it reliable for continuous operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature rating allows this transistor to operate in a wide range of temperature environments, making it versatile and reliable.

Maximum Drain Current (ID): 33 A

The high drain current rating allows this transistor to handle high continuous current flows, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.065 ohm

The low drain-source on resistance results in minimal power loss and heat generation, making this transistor efficient and suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPZ65R065C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

171 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

145 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPZ65R065C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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