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IPS511G

Infineon Technologies

IPS511G by Infineon Technologies

IPS511G by Infineon Technologies is a peripheral driver with a max supply voltage of 35V and built-in protections for transient, over current, and thermal issues. With a max output current of 2.5A, it is suitable for applications requiring sink output current flow direction in small outline packages. The turn-on and turn-off time are both 50µs, making it ideal for buffer or inverter-based interface IC types.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 72 parts In-Stock

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$1.100

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Chip Stock

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Vyrian

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Digiode

USA . 504 parts In-Stock

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Q Components

USA . 70 parts In-Stock

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LittleDiode

UK . 21 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 20 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 16 parts In-Stock

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Inland Empire Components Inc.

USA . 10 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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8

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Resion

USA . 6 parts In-Stock

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Ashlea Components Ltd

UK . 5 parts In-Stock

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Legend Electronics Inc.

USA . 5 parts In-Stock

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Semi Source

USA . 4 parts In-Stock

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4 Star Electronics, Inc.

USA . 4 parts In-Stock

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Rebound Electronics

UK . 1 parts In-Stock

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Distributors (Availability)

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$1.100

100+ parts

$1.045

1k+ parts

$0.993

10k+ parts

$0.979

800

$1.100

$1.045

$0.993

$0.979

Modulus Dynamics

Lithuania . 2,277 parts In-Stock

1+ parts

$3.972

100+ parts

$3.813

1k+ parts

$3.654

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2,277

$3.972

$3.813

$3.654

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AZTECH Wire

Italy . 686 parts In-Stock

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$4.980

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686

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Aztec Data Supply Inc.

USA . 131 parts In-Stock

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$5.050

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Corohmni

South Africa . 245 parts In-Stock

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$11.252

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Ampacity Inc.

Singapore . 607 parts In-Stock

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$20.500

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$20.500

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RC Electronics

USA . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,351 parts In-Stock

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Argo Parts USA

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Alle Elektronik GmbH

Germany . 3,567 parts In-Stock

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USA . 2,690 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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Kepictronics

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Continental Prestige Electronics

USA . 263 parts In-Stock

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Corphita

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Assy Fe

Spain . 104 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the IPS511G by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality peripheral drivers that guarantee reliability and performance. The IPS511G is a versatile component suitable for various applications, providing built-in protections against transient, overcurrent, and thermal issues. With a maximum output current of 2.5 A and a nominal output peak current limit of 5 A, this product ensures smooth operation and efficient power management. Upgrade your electronics today with the IPS511G and experience the difference in quality and functionality.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for long-term usage.

Surface Mount:

YES - Allows for easy and secure installation on circuit boards.

Maximum Supply Voltage:

35 V - Can handle high voltage inputs, making it versatile for different applications.

Package Shape:

RECTANGULAR - Offers a standard shape for easy integration into existing designs.

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL - Ensures safe operation and protects the device from damage.

No. of Terminals:

8 - Provides ample connections for various components in a circuit.

Package Style (Meter):

SMALL OUTLINE - Saves space and allows for compact designs.

Minimum Supply Voltage:

5.5 V - Works efficiently with lower voltage power sources.

Terminal Position:

DUAL - Enables flexible placement options on the circuit board.

Maximum Seated Height:

1.75 mm - Low profile design for space-constrained applications.

Width:

3.9 mm - Slim form factor for compact circuit layouts.

Length:

4.9 mm - Compact size for efficient use of space on the board.

Maximum Output Current:

2.5 A - Capable of driving high-current loads.

Terminal Form:

GULL WING - Easy soldering and secure attachment to the PCB.

Maximum Supply Current:

2 mA - Operates efficiently with low power consumption.

Nominal Supply Voltage:

14 V - Suitable for standard voltage requirements in many applications.

Turn-on Time:

50 us - Quick response time for immediate activation.

Terminal Pitch:

1.27 mm - Standard pitch for compatibility with various board layouts.

Nominal Output Peak Current Limit:

5 A - Handles peak current demands effectively.

Interface IC Type:

BUFFER OR INVERTER BASED PERIPHERAL DRIVER - Provides versatility for different signal processing needs.

Turn-off Time:

50 us - Ensures fast deactivation for precise control.

Output Current Flow Direction:

SINK - Ideal for sinking current from external devices.

Technical Specifications

Peripheral Drivers IPS511G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Maximum Output Current:

2.5 A

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

50 us

Turn-on Time:

50 us

Width:

3.9 mm

Trade Compliance

IPS511G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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