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IPP65R600C6XKSA1

Infineon Technologies

IPP65R600C6XKSA1 by Infineon Technologies

IPP65R600C6XKSA1 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 18A IDM, 142mJ EAS, and 0.6 ohm RDS(on). Package style is FLANGE MOUNT with SILICON element material and operates up to 150°C.

Median Price

$0.791

Lifecycle Status

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6

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1k+

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Arrow

USA . 332 parts In-Stock

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$0.447

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Chip1Stop

Japan . 332 parts In-Stock

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$0.899

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Rochester

USA . 269,141 parts In-Stock

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Verical

USA . 263,850 parts In-Stock

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$0.705

263,850

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$0.705

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Digiode

USA . 205 parts In-Stock

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$0.497

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Vyrian

USA . 2,591 parts In-Stock

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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$0.313

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Corphita

USA . 704 parts In-Stock

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$0.471

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$0.471

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Modulus Dynamics

Lithuania . 12,971 parts In-Stock

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$0.895

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$0.859

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$0.823

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12,971

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AZTECH Wire

Italy . 576 parts In-Stock

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$16.090

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Microchip USA

USA . 6,069 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of innovation with the IPP65R600C6XKSA1 by Infineon Technologies. As a leader in Power Field Effect Transistors (FET), Infineon Technologies delivers exceptional quality and reliability. This N-CHANNEL transistor is perfect for SWITCHING applications, offering a high DS Breakdown Voltage of 650V and a low on-resistance of 0.6 ohm. With a maximum pulsed drain current of 18A, this transistor provides efficient and robust performance. Whether you're designing power supplies, motor control systems, or lighting solutions, the IPP65R600C6XKSA1 offers unmatched value and versatility. Experience the difference with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them suitable for high performance applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage of 650V, this FET can handle high voltage applications with safety and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance for efficient performance.

Maximum Pulsed Drain Current (IDM): 18 A

The high maximum pulsed drain current rating of 18A allows this FET to handle high current pulses without overheating or damage.

Avalanche Energy Rating (EAS): 142 mJ

The high avalanche energy rating of 142mJ ensures that this FET can withstand sudden voltage spikes and surges without failure.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate reliably in high temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.6 ohm

The low on-resistance of 0.6 ohm ensures minimal power loss and heat generation, making this FET energy efficient.

Technical Specifications

Power Field Effect Transistors (FET) IPP65R600C6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

142 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP65R600C6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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