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IPP65R110CFDXKSA2

Infineon Technologies

IPP65R110CFDXKSA2 by Infineon Technologies

Infineon's IPP65R110CFDXKSA2 is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for SWITCHING applications. Featuring 99.6A IDM and 0.11 ohm RDS(on), it operates in ENHANCEMENT MODE with 277.8W power dissipation, suitable for high-power systems. With a temperature range of -55 to 150 °C, it offers reliable performance in various environments.

Median Price

$2.663

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 171 parts In-Stock

1+ parts

$5.900

100+ parts

$2.853

1k+ parts

$2.382

10k+ parts

-

171

$5.900

$2.853

$2.382

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Rochester

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$2.380

1k+ parts

$2.130

10k+ parts

$2.010

130

-

$2.380

$2.130

$2.010

Verical

USA . 130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.663

10k+ parts

$2.513

130

-

-

$2.663

$2.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 910 parts In-Stock

1+ parts

$2.698

100+ parts

-

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-

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910

$2.698

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-

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Vyrian

USA . 5,334 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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5,334

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 21,014 parts In-Stock

1+ parts

$1.080

100+ parts

$1.037

1k+ parts

$0.994

10k+ parts

-

21,014

$1.080

$1.037

$0.994

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Corphita

USA . 927 parts In-Stock

1+ parts

$2.556

100+ parts

-

1k+ parts

-

10k+ parts

-

927

$2.556

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-

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Microchip USA

USA . 2,377 parts In-Stock

1+ parts

$19.152

100+ parts

-

1k+ parts

-

10k+ parts

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2,377

$19.152

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QUARKTWIN TECHNOLOGY LTD

USA . 21,710 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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21,710

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Overview

Unleash the power of innovation with the IPP65R110CFDXKSA2 by Infineon Technologies, a leading manufacturer known for delivering top-quality Power Field Effect Transistors. This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering a minimum breakdown voltage of 650V and a maximum drain current of 31.2A. Whether you're looking to improve efficiency or enhance performance, this transistor's robust design and high energy rating make it a valuable asset in a variety of electronic devices. Elevate your projects with the reliability and versatility of the IPP65R110CFDXKSA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good thermal performance and durability, making the transistor reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher current carrying capacity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode provides protection against voltage spikes and reverse current flow, enhancing the reliability of the transistor in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various electronic circuits.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the transistor to withstand high voltage levels, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 99.6 A

High pulsed drain current rating enables the transistor to handle large current spikes without damage, ideal for demanding transient conditions.

Maximum Power Dissipation (Abs): 277.8 W

High power dissipation capability ensures the transistor can handle high power levels without overheating, providing reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low on-resistance and high efficiency, making the transistor suitable for power switching applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the transistor to operate in elevated temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance ensures minimal power loss and high efficiency in switching applications, making the transistor energy-efficient.

Technical Specifications

Power Field Effect Transistors (FET) IPP65R110CFDXKSA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

845 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

31.2 A

Maximum Drain Current (ID):

31.2 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

99.6 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP65R110CFDXKSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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