Loading...

IPP60R380C6XKSA1

Infineon Technologies

IPP60R380C6XKSA1 by Infineon Technologies

IPP60R380C6XKSA1 by Infineon Technologies is a N-CHANNEL power FET with 600V DS breakdown voltage. It is used for switching applications, with a max pulsed drain current of 30A and an avalanche energy rating of 210mJ.

Median Price

$1.375

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,743 parts In-Stock

1+ parts

-

100+ parts

$1.350

1k+ parts

$1.120

10k+ parts

$0.999

16,743

-

$1.350

$1.120

$0.999

Verical

USA . 15,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.400

10k+ parts

$1.249

15,743

-

-

$1.400

$1.249

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 173 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$1.054

-

-

-

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$1.320

-

-

-

Schukat

Germany . 564 parts In-Stock

1+ parts

$2.280

100+ parts

$1.307

1k+ parts

-

10k+ parts

-

564

$2.280

$1.307

-

-

Chip Stock

USA . 4,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,710

-

-

-

-

Vyrian

USA . 3,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,542

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 139 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$0.940

-

-

-

Corphita

USA . 598 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

598

$0.999

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.294

100+ parts

-

1k+ parts

$1.242

10k+ parts

-

100

$1.294

-

$1.242

-

Continental Prestige Electronics

USA . 3,551 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

$1.294

3,551

$1.320

-

-

$1.294

Argo Parts USA

USA . 1,453 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

1,453

$1.320

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.346

100+ parts

$1.346

1k+ parts

$1.346

10k+ parts

-

350

$1.346

$1.346

$1.346

-

Modulus Dynamics

Lithuania . 12,255 parts In-Stock

1+ parts

$1.548

100+ parts

$1.486

1k+ parts

$1.424

10k+ parts

-

12,255

$1.548

$1.486

$1.424

-

Corohmni

South Africa . 472 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

-

472

$1.584

-

-

-

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$14.495

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$14.495

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,669

-

-

-

-

Perfect Parts

USA . 1,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,282

-

-

-

-

Overview

Looking for a reliable power field effect transistor? Look no further than the IPP60R380C6XKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies is known for their top-notch quality and innovative solutions. The IPP60R380C6XKSA1 is a game-changer in the field of switching applications, offering enhanced performance and efficiency. With a minimum DS breakdown voltage of 600V, maximum pulsed drain current of 30A, and an avalanche energy rating of 210mJ, this transistor delivers exceptional power and reliability. Its N-channel configuration with a built-in diode ensures seamless operation, while its single terminal position and through-hole terminal form make it easy to integrate into any project. Don't settle for mediocrity when you can experience the advantages and benefits that the IPP60R380C6XKSA1 offers. Upgrade your systems today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy material for its package body offers durability and protection, making it an excellent choice for power applications.

Polarity or Channel Type: N-CHANNEL

With its N-channel type, this power FET provides efficient current flow and high performance in electronic circuits, making it an ideal choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Featuring a single configuration with a built-in diode, this FET simplifies circuit designs and enhances efficiency by eliminating the need for an external diode.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET allows for rapid switching speeds and ensures smooth performance in various electronic systems.

Minimum DS Breakdown Voltage: 600 V

With a minimum DS breakdown voltage of 600 V, this FET can handle high voltage levels, providing reliable power distribution and protection against overloading.

Package Shape: RECTANGULAR

The rectangular package shape of this FET offers easy mounting and integration into circuit boards, facilitating efficient installation and space-saving designs.

Terminal Form: THROUGH-HOLE

With a through-hole terminal form, this FET provides reliable electrical connections and easy soldering, ensuring hassle-free circuit assembly.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows this FET to deliver high-performance amplification and improved control over power flow, making it an optimal choice for demanding applications.

Maximum Pulsed Drain Current (IDM): 30 A

With a maximum pulsed drain current of 30 A, this power FET can handle short-duration current pulses, making it suitable for high-power applications and devices.

Avalanche Energy Rating (EAS): 210 mJ

Featuring a high avalanche energy rating of 210 mJ, this FET offers robust protection against voltage spikes and transient events, enhancing the product's reliability and longevity.

No. of Terminals: 3

With three terminals, this FET provides simple and efficient connectivity options, enabling easy integration into electronic systems and ensuring proper circuit functionality.

Package Style (Meter): FLANGE MOUNT

The flange mount package style of this FET allows for secure and stable mechanical mounting, minimizing the risk of damage and ensuring reliable performance in various environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this FET provides enhanced power efficiency, minimal power losses, and improved overall performance, making it a reliable choice for power-sensitive applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments, ensuring stable operation and prolonged product lifespan.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures excellent conductivity, low power dissipation, and superior thermal stability, making this FET a reliable choice for power applications.

Terminal Finish: TIN

With a tin terminal finish, this FET offers good solderability and corrosion resistance, ensuring secure and durable electrical connections in various operating conditions.

Maximum Drain Current (ID): 10.6 A

With a maximum drain current of 10.6 A, this FET can efficiently handle high current loads, making it suitable for demanding power switching applications.

Maximum Drain-Source On Resistance: 0.38 ohm

Featuring a low maximum drain-source on resistance of 0.38 ohm, this FET minimizes power losses and ensures efficient power flow, making it an excellent choice for high-performance power applications.

Terminal Position: SINGLE

With a single terminal position, this FET offers simplicity and ease of installation, ensuring proper alignment and straightforward integration into circuit layouts.

Technical Specifications

Power Field Effect Transistors (FET) IPP60R380C6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

210 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

10.6 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP60R380C6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21