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IPP50R280CE

Infineon Technologies

IPP50R280CE by Infineon Technologies

IPP50R280CE by Infineon Technologies is a N-CHANNEL FET with 500V DS breakdown voltage, 0.28 ohm max RDS(on), and 42.9A IDM. Ideal for switching applications due to its single configuration with built-in diode and enhancement mode operation. Package style is flange mount with through-hole terminals.

Median Price

$1.577

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 892 parts In-Stock

1+ parts

$1.640

100+ parts

$0.697

1k+ parts

$0.477

10k+ parts

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892

$1.640

$0.697

$0.477

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Verical

USA . 500 parts In-Stock

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-

100+ parts

$1.514

1k+ parts

$1.401

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500

-

$1.514

$1.401

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Distributors (In-Stock)

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Maritex

Poland . 11,531 parts In-Stock

1+ parts

$0.886

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11,531

$0.886

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Digiode

USA . 152 parts In-Stock

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$1.434

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152

$1.434

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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Vyrian

USA . 907 parts In-Stock

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907

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Nova Conductors

Japan . 28 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 22,260 parts In-Stock

1+ parts

$1.013

100+ parts

$0.972

1k+ parts

$0.932

10k+ parts

-

22,260

$1.013

$0.972

$0.932

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Corohmni

South Africa . 863 parts In-Stock

1+ parts

$1.058

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863

$1.058

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Semicontronic

India . 650 parts In-Stock

1+ parts

$1.130

100+ parts

$1.102

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$1.096

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650

$1.130

$1.102

$1.096

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Ampacity Inc.

Singapore . 1,031 parts In-Stock

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$1.170

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$1.170

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Corphita

USA . 166 parts In-Stock

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$1.359

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166

$1.359

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CoreStaff

Japan . 500 parts In-Stock

1+ parts

$2.080

100+ parts

$0.783

1k+ parts

$0.738

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500

$2.080

$0.783

$0.738

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 9,229 parts In-Stock

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Lixinc

USA . 9,124 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,424 parts In-Stock

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Continental Prestige Electronics

USA . 4,560 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,616 parts In-Stock

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Kepictronics

USA . 934 parts In-Stock

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Argo Parts USA

USA . 72 parts In-Stock

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Bastille Electronics

Australia . 52 parts In-Stock

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Overview

Infineon's CoolMOS™ CE Power MOSFETs are a technology platform of high voltage power MOSFETs that are designed according to the super junction principle (SJ) and conceived to fulfill consumer requirements. CoolMOS™ CE portfolio offers 500V, 600V, 650V, 700V, and 800V devices targeting low power chargers for mobile devices and power tools, adapters for notebook and laptops, LCD, LED TV and LED lighting. This new series of CoolMOS™ is cost-optimized to meet typical requirements in consumers with no compromise on proven CoolMOS™ quality and reliability while still being price attractive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors have higher mobility of charge carriers, offering better performance and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing overall reliability.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can quickly turn on and off, making it suitable for power management systems.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this transistor can handle high voltages without damage, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and mounting in various electronic devices or circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, making installation hassle-free.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer faster switching speeds and lower power consumption, making them an efficient choice for applications requiring high performance.

Maximum Pulsed Drain Current (IDM): 42.9 A

The high pulsed drain current rating allows this transistor to handle sudden surges of current, making it suitable for applications with fluctuating power requirements.

Avalanche Energy Rating (EAS): 231 mJ

The high avalanche energy rating indicates the transistor's ability to withstand short-term high-energy spikes without damage, ensuring reliability in challenging environments.

No. of Terminals: 3

With three terminals, this transistor can easily be integrated into existing circuits or PCB designs.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mechanical mounting, ensuring stability in high-vibration environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds, low power consumption, and reliable performance, making this transistor suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency, making this transistor a durable and high-performance choice.

Terminal Finish: TIN

The tin terminal finish offers corrosion resistance and ensures reliable electrical connections over time.

Maximum Drain-Source On Resistance: 0.28 ohm

The low drain-source on resistance minimizes power loss and heat generation, improving overall efficiency and performance.

Terminal Position: SINGLE

With a single terminal position, this transistor is easy to install and connect in circuits or PCB layouts.

Technical Specifications

Power Field Effect Transistors (FET) IPP50R280CE attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

231 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

42.9 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP50R280CE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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